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Results 421-430 of 526 (Search time: 0.007 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Active circuit to through silicon via (TSV) noise coupling Cho, J.; Shim, J.; Song, E.; Pak, J.S.; Lee, J.; Lee, H.; Kim, Joungho, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.97 - 100, IEEE, 2009-10-19 | |
| Modeling and measurement of radiated emission through a cutout on the power/ground plane Lee, J.; Kang, J.; Park, K.; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.776 - 780, IEEE, 2006-08-14 | |
| Analysis of the Vertical Electromagnetic Bandgap Structures in the Power Distribution Network for the Multi-layer Printed Circuit Board Yoo, Jeongsik; Park, Hyunjeong; Park, Jongbae; Kim, Junchul; Shim, Yujeong; Kim, Joungho, IEEE Electronics Packaging Technology Conference, EPTC, pp.1381 - 1386, IEEE, 2009-01-27 | |
| Sharing power distribution networks for enhanced power integrity by using through-silicon-via Pak, J.S.; Kim, Joungho; Lee, J.; Lee, H.; Park, K.; Kim, J., 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.9 - 12, IEEE, 2008-12-10 | |
| Mode-impedance method for modeling and analysis of crosstalk in differential meander delay lines Kim, G.; Kim, J.; Lee, S.; Kim, J.; Kim, Joungho, 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.93 - 96, IEEE, 2008-12-10 | |
| A through-silicon-via to active device noise coupling study for CMOS SOI technology Duan, X.; Gu, X.; Cho, J.; Kim, Joungho, 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.1791 - 1795, ECTC 2011, 2011-05-31 | |
| Extraction of equivalent inductance in package-PCB hierarchical power distribution network Kim, J.; Kim, J.; Ren, L.; Fan, J.; Kim, Joungho; Drewniak, J.L., 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.109 - 112, IEEE, 2009-10-19 | |
| Slow wave and dielectric quasi-TEM modes of metal-insulator-semiconductor (MIS) structure through silicon via (TSV) in signal propagation and power delivery in 3D chip package Pak, Jun So; Cho, J.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 60th Electronic Components and Technology Conference, ECTC 2010, pp.667 - 672, ECTC 2010, 2010-06-01 | |
| Design of toroidal current probe embedded in multi-layer printed circuit boards for electrostatic discharge(ESD) detection Sung, H.; Song, E.; Kim, M.; Shim, Y.; Kong, S.; Kwon, J.; Kim, Joungho, 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010, IEEE, 2010-12-07 | |
| Compensation of unbalanced capacitive crosstalk noise in category-SE modular jack using balancing capacitor in PCB Kim, Joungho; Kim, Namhoon; Sung, Myunghee; Kim, Yhungsoo; Baek, Seungyong; Ryu, Woonghwan, EPEP2000, IEEE, 2000-10 |
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