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Results 421-428 of 428 (Search time: 0.004 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
421
Measurement, Simulation and Mathematical Estimation of Magnetic Field Shielding Effectiveness of Sputtered Shielding Materials using Spiral Coils

Song, Kyunghwan; Kim, Subin; Jeong, Seungtaek; Kim, Dong-Hyun; Son, Kyungjune; Heo, Jin; Han, Kyumin; Jung, Yusup; Kim, Hongseok; Kim, Jounghoresearcher, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, pp.47 - 51, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, 2018-08-01

422
Estimation and Analysis of Crosstalk Effects in High-Bandwidth Memory Channel

Choi, Sumin; Kim, Heegon; Park, Junyong; Kim, Dong-Hyun; Jung, Daniel H; Lim, Jaemin; Cho, Kyungjun; Kim, Jounghoresearcher, 2018 Joint Institute of Electrical and Electronics Engineers Eletromagnetic Compatibility (EMC) & Asia-Pacific international symposium on Eletromagnetic Compatibility (APEMC), pp.4 - 4, IEEE EMC & APEMC, 2018-05-16

423
Eye-Diagram Estimation with Stochastic Model for 8B/10B Encoded High-Speed Channel

Park, Junyong; Kim, Dong-Hyun; Kim, Youngwoo; Choi, Sumin; Kim, Jounghoresearcher, 2018 Joint Institute of Electrical and Electronics Engineers Eletromagnetic Compatibility (EMC) & Asia-Pacific international symposium on Eletromagnetic Compatibility (APEMC), IEEE EMC & APEMC, 2018-05-16

424
Bias-dependent Power Distribution Network Impedance Analysis with MOS Capacitor

Kim, Dong-Hyun; Kim, Subin; Park, Junyong; Kim, Youngwoo; Choi, Sumin; Cho, Kyungjun; Kim, Jounghoresearcher, 2018 Joint Institute of Electrical and Electronics Engineers Eletromagnetic Compatibility (EMC) & Asia-Pacific international symposium on Eletromagnetic Compatibility (APEMC), pp.40 - 40, IEEE EMC & APEMC, 2018-05-16

425
Modeling and Signal Integrity Analysis of 3D XPoint Memory Cells and Interconnections with Memory Size Variations During Read Operation

Son, Kyungjune; Cho, Kyungjun; Kim, Subin; Park, Gapyeol; Song, Kyunghwan; Kim, Jounghoresearcher, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, pp.223 - 227, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, 2018-08-01

426
Modeling of Through-silicon Via (TSV) with an hmbedded High-density Metal-insulator-metal (MIM) Capacitor

Cho, Kyunjun; Kim, Youngwoo; Kim, Subin; Park, Gapyeol; Son, Kyungjune; Park, Hyunwook; Kim, Seongguk; Choi, Sumin; Kim, Dong-Hyun; Kim, Jounghoresearcher, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), IEEE, 2018-12

427
Statistical Eye-Diagram Estimation Method for High Speed Channel with N-Tap Decision Feedback Equalizer (DFE)

Park, Junyong; Song, Huijin; Kim, Dong-Hyun; Choi, Sumin; Kim, Jounghoresearcher, Joint 60th IEEE International Symposium on Electromagnetic Compatibility (EMC) / IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), pp.1027 - 1032, IEEE, 2018-05

428
Study of Series-series Topology for Suppressing Electromagnetic Interference (EMI) for Digital TV Wireless Power Transfer (WPT) Systems

Das, Mumpy; Jeong, Seungtaek; Sim, Boogyo; Lee, Seongsoo; Hong, Seokwoo; Kim, Youngwoo; Kim, Jounghoresearcher, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), IEEE, 2018-12

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