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Results 411-420 of 526 (Search time: 0.003 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Microwave Model of Anisotropic Conductive Adhesive Flip-Chip Interconnections for High Frequency Applications Kim, Joungho; Paik, Kyung-Wook; Yim, M; Ryu, W; Jeon, Y, Electronic Components and Technology Conference, Electronic Components and Technology Conference, 1999-05 | |
| An Efficient Crosstalk Parameter Extraction of Embedded Microstrip Structures on High-speed MCM Kim, Joungho; Sung, M; Ryu, W; Kim, H; Kim, J, 49th Electronic Components and Technology Conference, pp.0, 49th Electronic Components and Technology Conference, 1999-05 | |
| Interconnection line structures on MCM-Si for giga-hertz quasi-TEM signal transmission Ryu, Woonghwan; Kim, Hyungsoo; Kim, Jonghoon; Ko, Kyoungmin; Kim, Joungho, Proceedings of the 1998 48th Electronic Components & Technology Conference, pp.1068 - 1072, Electronic Components & Technology Conference, 1998-05-25 | |
| Estimation of data-dependent jitter using single pulse analysis method in high-speed differential signaling Song, E.; Lee, J.; Kim, J.; Kam, D.G.; Ryu, C.; Kim, Joungho, ESTC 2006 - 1st Electronics Systemintegration Technology Conference, pp.741 - 746, IEEE, 2006-09-05 | |
| Coupling of through-hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB Pak, J.S.; Kim, J.; Lee, H.; Byun, J.-G.; Kim, Joungho, 2003 IEEE Symposium on Electromagnetic Compatibility, pp.231 - 235, IEEE, 2003-08-18 | |
| The scalable modeling of multi-layer embedded capacitor based on LTCC substrate Park, J.; Lu, A.C.W.; Fan, W.; Wai, L.L.; Chua, K.M.; Shim, Y.; Kim, Joungho, IEEE 56th Electronic Components and Technology Conference, pp.1286 - 1289, IEEE, 2006-05-30 | |
| Design and analysis of improved multi-module memory bus using Wilkinson power divider Kim, J.; Song, E.; Kim, J.; Kim, Joungho; Sung, M.; Kim, J.; So, B., IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.642 - 645, IEEE, 2006-08-14 | |
| Noise isolation in LTCC-based X/Ku-band transceiver SiP using double-stacked electromagnetic bandgap structure Park, J.; Kim, J.; Lu A.C.W.; Shim, Y.; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, IEEE, 2007-07-09 | |
| Networks-in-package; design, analysis and implementation Kim, G.; Lee, K.; Kim, J.; Bae, K.; Lee, C.; Yoo, H.-J.; Kim, Joungho, 14th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP, pp.221 - 224, IEEE, 2006-10-23 | |
| A designated clock generation and distribution (DCGD) chip scheme for substrate noise-free 3-D stacked SiP design Lee, W.; Ryu, C.; Cho, J.; Song, E.; Kim, Joungho, 2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010, pp.334 - 337, APEMC 2010, 2010-04-12 |
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