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Results 41-50 of 526 (Search time: 0.008 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
41
GHz twisted differential line structure on printed circuit board to minimize EMI and crosstalk noises

Kam, D.G.; Lee, H.; Baek, S.; Park, B.; Kim, Joungho, 52nd Electronic Components and Technology Conference, pp.1058 - 1065, 2002-05-28

42
Design guidelines of spread spectrum clock for suppression of radiation and interference from high-speed interconnection line

Kim, J.; Jun, P.; Byun, J.-G.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.189 - 192, IEEE, 2002-05-12

43
Solution Space Analysis of Interconnects for Low voltage Differencial Signaling(LVDS)Applications

Kim, Joungho; Ahn, S; Lu, A C W.; Fan, W; Wai, L L, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP2001), pp.297 - 330, 2001

44
Effect of power/ground partitioning and stitching capacitor placement on signal integrity and emi of multi-layer and multi power system

Kim, Joungho; Kim, H.; Lee, H.; Kim, J.; Kim, J., Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.59 - 62, 2001-07-08

45
A Delay Line Circuit Design For Crosstalk Minimization Using Genetic Algorithm

Kim, Joungho; Chung, Chaeho; Lee, Soobum; Kwak, Byungman; Kim, Gawon, China-Japan-Korea Joint Symposium on Optimization of Structural and Mechanical Systems, pp.551 - 556, 2006

46
High-frequency Electrical Model of Chip-to-Chip Via Interconnection for 3-D Chip Stacking Package

Kim, Joungho; Ryu, Chunghyun; Chung, Daehyun; Lee, Junho; Lee, Kwangyong; Oh, Taesung, IEEE 14th(13) Topical Meeting on Electrical Performance of Electronic Packaging, pp.151 - 154, IEEE, 2005-10

47
Microwave Frequency Model of Flip-Chip interconnects using Anisotripic Conductive Film

Kim, Joungho, HDP/MCM conference, 1999

48
An evaluation of differential impedance in PCBs using two single-ended probes only

Kam, D.G.; Lee, H.; Ryu, W.; Kim, J.; Park, B.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.169 - 171, IEEE, 2002-05-12

49
Multi-Chip Module (MCM) RF Transceiver For 1.8 GHz Cellular Phone

Kim, Joungho; Kim, Namhoon; Ryu, Woonghwan; Kim, Jonghoon; Kim, Hyungsoo; Ahn, Seungyoung; Kim, Sungil; Song, Hangok, APACK99, Symposium on Advances in packaging, pp.440 - 443, 1999-12

50
Picosecond Time-Domain Photoconductive Sampling Method For Measuring Guided and Free-Space Pulse Propagation

Kim, Joungho; Ryu, Jaeyoung; Lee, Jongjoo; Lee, Heeseok; Kim, Woopoung, 8th Topical Meeting on Electrical Performance of Electronic Packaging, 1999

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