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Results 391-400 of 428 (Search time: 0.005 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
391
Power Distribution Network (PDN) Design and Analysis of A Single and Double-Sided High Bandwidth Memory (HBM) Interposer for 2.5D Terabtye/s Bandwidth System

Cho, Kyungjun; Kim, Jounghoresearcher; Kim, Youngwoo; Kim, Subin; Lee, Hyunsuk; Choi, Sumin; Kim, Heegon, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27

392
Eye-diagram Estimation and Analysis of High-Bandwidth Memory (HBM) Interposer Channel with Crosstalk Reduction Schemes on 2.5D and 3D IC

Choi, Sumin; Kim, Jounghoresearcher; Kim, Heegon; Kim, Jonghoon J; Lim, Jaemin; Lee, Hyunsuk; Cho, Kyungjun, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27

393
Electromagnetic Interference on Analog-to-Digital Converters from High-Power Wireless Power Transfer System for Automotive Charger

Kong, Sunkyu; Kim, Jounghoresearcher; Bae, Bumhee; Kim, Dong-Hyun; Kim, Hongseok; Song, Chiuk, IEEE International Conference on Electromagnetic Compatibility (EMC 2016), IEEE International Conference on Electromagnetic Compatibility (EMC 2016), 2016-07-27

394
Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test

Kim, Jonghoon J; Kim, Jounghoresearcher; Kim, Heegon; Jung, Daniel H; Choi, Sumin; Lim, Jaemin; Park, Junyong; Kim, Jiseong, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27

395
Eye Diagram Estimation of 8B/10B Encoded Highspeed Serial Link for Signal Integrity Test using Silicone Rubber Socket

Park, Junyong; Kim, Jounghoresearcher; Kim, Jonghoon J; Kim, Heegon; Bae, Michael; Ha, Dongho, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27

396
EMI Reduction Method of Three Phase WPT Charger for Drone with Duty Control of Vsi

Song, Chiuk; Kim, Jounghoresearcher; Kim, Hongseok; Yoon, Kibum; Cho, Yeonje; Lee, Seongsoo; Jeong, Seungtaek; Jo, Kyoungyoung; Kim, Youngbeom; Moon, Heechang, Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), 2016-05-21

397
Analysis of Vertical PCB Connector Induced Via Stub Reduction in High Speed Serial Link

Kim, Dong-Hyun; Kim, Jounghoresearcher; Kim, Heegon; Lim, Jaemin; Jeon, Yeseul; Koh, Wee Jin; Chang, Weng Yew Richard, Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), 2016-05-19

398
Electromagnetic Bandgap Design for Power Distribution Network Noise Isolation in the Glass Interposer

Kim, Jounghoresearcher; Kim, Youngwoo; Song, Jinwook; Kim, Subin; Venky, Sundaram; Ao, Tummala; Cho, Jonghyun, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31

399
Mobile AP GPU Power Distribution Network Simulation and Analysis based on Chip Power Model

Kim, Youngwoo; Kim, Jounghoresearcher; Kim, Heegon; Cho, Jonghyun; Kang, Kibum; Yang, Taisik; Paik, Woohyun, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27

400
Signal Integrity of Bump-less High-speed Through Silicon Via Channel for Terabyte/s Bandwidth 2.5D IC

Lee, Hyunsuk; Kim, Jounghoresearcher; Kim, Heegon; Choi, Sumin; Lim, Jaemin; Cho, Kyungjun; Jeon, Yeseul, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31

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