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Results 391-400 of 526 (Search time: 0.007 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
391
Delay Line Circuit Design For Crosstalk Minimization Using Genetic Algorithm

Chung, Chaeho; Lee, Soobum; Kwak, Byung Man; Kim, Gawon; Kim, Joungho, China-Japan-Korea Joint Symposium on Optimization of Structural and Mechanical Systems, pp.551 - 556, CJK-OSM, 2006-11-06

392
Analysis of the effect of AC noise on DC bias of VGA for UHF RFID using chip-package co-modeling and simulation

Lee, H.; Shim, Y.; Park, H.; Ryu, C.; Yoon, C.; Kim, Joungho, 9th Electronics Packaging Technology Conference, EPTC 2007, pp.591 - 594, IEEE, 2007-12-12

393
Compensation of undesired channel effects by frequency domain optimization of pre-emphasis filter for over gbps signaling

Kim, J.; Lee, J.; Song, E.; Jo, J.; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.721 - 726, IEEE, 2006-08-14

394
Effect of EBG structures for reducing noise in multi-layer PCBs for digital systems

Chung, D.; Kim, T.H.; Ryu, C.; Engin, E.; Swaminathan, M.; Kim, Joungho, IEEE 15th Topical Meeting on Electrical Performance of Electronic Packaging, pp.253 - 256, IEEE, 2006-10-23

395
Analysis of power/ground noise effect on performance degradation of analog-to-digital converter

Ahn, W.; Shim, J.; Cho, J.; Shin, Mincheol; Koo, K.; Kim, Joungho, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.687 - 691, 123, 2009-12-09

396
Large object detection in cluttered background using boosted Markov chain Monte Carlo

Kim, S.; Kim, Joungho; Park, C.; Kweon, In-So, 11th International Conference on Control, Automation, Robotics and Vision, ICARCV 2010, pp.2096 - 2101, ICARCV 2010, 2010-12-07

397
Electrical characterization of Trough Silicon Via (TSV) depending on structural and material parameters based on 3D full wave simulation

Pak, J.S.; Ryu, C.; Kim, Joungho, International Conference on Electronic Materials and Packaging, EMAP 2007, IEEE, 2007-11-19

398
Vertical electromagnetic bandgap structure for noise suppression in single-ended and differential signaling on a multi-layer backplane board

Hwang, C; Jongbae P.; Jaemin K.; Kyoungchoul K.; Kim, Joungho, 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009, pp.197 - 200, IEEE, 2009-01-12

399
Hybrid modeling and analysis of power supply noise effects on analog-to-digital converter considering hierarchical PDNs

Bae, B.; Shim, Y.; Lee, W.; Koo, K.; Ahn, W.; Kim, Joungho, 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010, IEEE, 2010-12-07

400
Design of UWB transceiver SiP for short range communication

Yoon, C.; Park, H.; Kim, Joungho; Lee, J.; Park, Y., IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, IEEE, 2007-07-09

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