Results 371-380 of 526 (Search time: 0.008 seconds).
NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Through silicon via (TSV) equalizer Kim, Joungho; Song, E.; Cho, J.; Pak, J.S.; Lee, J.; Lee, H.; Kim, J., 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.13 - 16, 123, 2009-10-19 | |
A precise analytical eye-diagram estimation method for non-ideal high-speed channels Cho, J.; Song, E.; Shim, J.; Kim, J.; Kim, Joungho, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.159 - 162, IEEE, 2009-10-19 | |
Fabrication and evaluation of 3D packages with through hole via Jang, D.M.; Lee, K.Y.; Ryu, C.H.; Cho, B.H.; Oh, T.S.; Kim, Joungho; Lee, W.J.; Yu, J., 2006 MRS Fall Meeting, pp.171 - 178, 123, 2006-11-27 | |
Causality enforcement in transient simulation of HDMI interconnects with magnitude equalization Song, Eakhwan; Cho, Jeonghyeon; Kim, Joungho; Kam, Dong Gun, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 4, IEEE, 2007-07-09 | |
Noise isolation modeling and experimental validation of power distribution network in chip-package Park, H.; Yoon, C.; Koo, K.; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, IEEE, 2007-07-09 | |
Robust 3-D visual SLAM in a large-scale environment Kim, Joungho; Yoon, K.-J.; Kweon, In-So, 14th International Symposium of Robotic Research, ISRR 2009, pp.519 - 534, 123, 2009-08-31 | |
Suppression of power/ground noise using Meshed-Planar Electromagnetic Bandgap (MP-EBG) structure for Ultra-Wideband (UWB) system-in-package (SiP) Kim, M.; Yoon, C.; Koo, K.; Hwang, C.; Sung, H.; Kim, Joungho, 2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010, pp.28 - 31, IEEE, 2010-07-25 | |
Investigation of experimental verification for various Power Distribution Network cases through DLL clock jitter affected by SSN Shin, M.; Shim, J.; Shim, Y.; Kim, Joungho, 2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010, pp.325 - 329, APEMC 2010, 2010-04-12 | |
A frequency tunable resonant clock distribution scheme using bond-wire inductor Lee, W.; Pak, J.S.; Pak, J.; Ryu, C.; Park, J.; Kim, Joungho, 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.24 - 26, IEEE, 2008-12-10 | |
Analytical modeling of power distribution network with embedded electromagnetic bandgap structure Hwang, C.; Kim, J.; Shim, Y.; Kim, Joungho, 2009 IEEE International Symposium on Electromagnetic Compatibility, EMC 2009, pp.69 - 73, IEEE, 2009-08-17 |
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