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Results 31-40 of 525 (Search time: 0.006 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
31
An undergraduate class for high-frequency design, fabrication, and measurement

Kim, Joungho; Ahn, S.; Park, B.; Chung, Y., Advances in Electronic Packaging, v.3, pp.1827 - 1830, 2001-07-08

32
A Novel Time domain Picosecond Pulse Sampling System for Non-contact Characterization of Liquids Semiconductors, and Metals

Kim, Joungho; Kim, Woopoung; Ryu, aeyoung; Lee, Heeseok, CLEO/Pacific Rim '99, pp.791 - 792, 1999

33
Photoconductive Sampling Using Phase Retrieval algorithm

Kim, Joungho; Kim, WP; Lee, JJ, Inter. Topical Workshop on Contemporary Photonics Technology231, 1998-01

34
Transient Response of Terahertz Emitter using Finite-Difference Time-Domain (FDTD) Method

Kim, Joungho; Lee, Heeseok; Lee, Jaehoon, The Sixth IEEE International Conference on Terahertz Electronics, pp.208 - 210, 1998-09

35
Low noise THz Emitter Using Lift-off LT-GaAs Thin Film Sitch on Fused Silica

Kim, Joungho; Baek, Seungyong; Lee, Jongjoo; Ryu, Jaeyoung; Jung, Yuchul; Lee, Heeseok, International Terahertz workshop 2000, 2000

36
Application of a 3-D Field Solver for On-chip and Package Microstrip Interconnection Design

Kim, Joungho; Ryu, Woonghwan; Lu, Albert; Wai, Chee; Wei, Fan, IEEE EPTC 2000, IEEE, 2000

37
The improvement of Signal Integrity (SI) according to the location of via in the vicinity of a slot in the reference plane

Kim, T.H.; Lee, J.; Kim, H.; Jun, P.J.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.185 - 188, IEEE, 2002-05-12

38
Slot transmission line model of interconnections crossing split power/ground plane on high-speed multi-layer board

Kim, Joungho; Kim, H.; Jeong, Y.; Lee, J.; Kim, J., 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.23 - 26, 2002-05-12

39
Unit-cell modeling of high-speed interconnect with adjacent metal-filled via array using FDTD method

Lee, Heeseok; Park C.; Kam D.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.41 - 43, IEEE, 2002-05-12

40
Microwae Frequency Model and High-density design of Multiple Line Grid Array (MLGA) Package

Kim, Joungho; Ahn, Seungyoung; Lee, Joonwoo; Kim, Jonghoon; Ryu, Woonghwan; Kim, Youngsoo; Choi, Hyun Seok; Kum, Byung Hun; Yoon, Chong K., IMAPS 2000, 2000

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