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Results 31-40 of 197 (Search time: 0.007 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Chip-Package-Circuit Co-modeling for Analysis of Digital Power and Ground Noise Coupling Effect on CMOS Negative Feedback Operational Amplifier Kim, Joungho; Shim, Yujeong; Park, Jongbae, EMC compo, 2007 | |
| Reduction of multilayer PCB edge radiation excited by through-hole signal via with De-Cap Fence Kim, Joungho; Pak, J. S.; Lee, J., 2003 Asia-Pacific Microwave Conference, pp.870 - 873, 2003 | |
| Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole Lee, H.; Hong, Y.-S.; Kam, D.; Kim, Joungho, Proceedings - 8th IEEE Workshop on Signal Propagation on Interconnects, pp.31 - 34, 2004-05-09 | |
| A MLGA Connector for High speed and High Density Kim, Joungho; Kim, Young Soo; Choi, Hyung Seok; Ko, Youngwoo; Bang, Hyo Jae; Kim, Woo Kyung; Baek, Seungyong; Lee, Junwoo; Ahn, Seungyoung, HD International 2001 (The International Conference and Exhibition on High Density Interconnect and Systems packaging), 2001 | |
| A chip-package hybrid DLL loop and clock distribution network for low-jitter clock delivery Chung, D.; Ryu, C.; Kim, H.; Lee, C.; Kim, J.; Kim, J.; Bae, K.; Yu, J.; Lee, S.; Yoo, H.; Kim, Joungho, 2005 IEEE International Solid-State Circuits Conference, ISSCC, v.48, pp.514 - 614, 2005-02-06 | |
| Tapered Slot Shape on Slotted Reference Plane of Multi-layer PCB for Reduction of Crosstalk and Radiated Emission Kim, Joungho; Kim, Jingook; Kim, Hyungsoo; Jeong, Youchul, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.275 - 278, IEEE, 2002 | |
| A Novel Twisted Differential Line on PCB: Crosstalk Model and Its Application to High-speed Interconnect Circuit Design Kim, Joungho; Kam, Dong Gun, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.153 - 156, IEEE, 2002 | |
| Analysis of Power/Ground Network for Mixed Mode Circuits in Multi-layer PCB Kim, Joungho; Jeong, Y.; Kim, H.; Park, J.; Kim, J, 2003 Asia-Pacific Microwave Conference, 2003 | |
| A New 3.0T Hybrid-Spiral-Birdcage (HSB) Coil for Improved Homigeneity Along Z-Axis Kim, Joungho; Park, Jun So; Kim, Jonghoon; Lee, Jong-O; Park, Bu-sik; Jung, Seung-Pil; Jung, Kwan-jin, International Society for Magneitc Resonance of Imaging, 2000 | |
| A Novel Twisted Differential Line for High-speed On-chip Interconnections with Reduced Crosstalk Kim, Joungho; Kam, Dong Gun; Ahn, Seungyoung; Baek, Seungyong; Park, Bongcheol; Sung, Myunghee, IEEE 4th Electronics Packaging Technology Conference, pp.180 - 183, IEEE, 2002 |
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