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Results 21-28 of 28 (Search time: 0.006 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
21
High-Freuquency TSV Failure Analysis

Kim, Joohee; Cho, Jonghyun; Jung, Hyunsuk; Pak, Jun So; Yook, Jong-Min; Kim, Joungho; Kim, Jun Chul, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24

22
Slow wave and dielectric quasi-TEM modes of metal-insulator-semiconductor (MIS) structure through silicon via (TSV) in signal propagation and power delivery in 3D chip package

Pak, Jun So; Cho, J.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 60th Electronic Components and Technology Conference, ECTC 2010, pp.667 - 672, ECTC 2010, 2010-06-01

23
Low frequency electromagnetic field reduction techniques for the On-Line Electric Vehicle (OLEV)

Ahn, Seungyoung; Pak, Jun So; Taigon Song; Lee, Hee Jae; Jung-Gun Byun; Deogsoo Kang; Cheol-Seung Choi; Eunjung Kim; Jiyun Ryu; Mijoo Kim; Yumin Ch; CHUN, YANGBAE; Rim, Chun Taek; Jae-Ha Yim; Cho, Dong-Ho; Kim, Joungho, 2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010, pp.625 - 630, IEEE, 2010-07-25

24
Temperature-Dependent Through-Silicon Via (TSV) Model and Noise Coupling

Lee, Manho; Cho,Jonghyun; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; Park, Kunwoo, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24

25
Through-Silicon Via (TSV) Depletion Effect

Cho, Jonghyun; Kim, Myunghoi; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; Pak, Kunwoo, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24

26
Slots on Ground Fillings of Multi-layer Printed Circuit Board for Suppressing Indirect Crosstalk between Digital Clock Line and RF Signal Line in Mixed Mode Mobile Systems

Pak, Jun So; Hong, Frank; Kim, Austin; Kim, Joungho; Kim, Gawon, Presented at Proceeding of 2008 IEEE EMC Symposium, pp.1 - 6, IEEE, 2008-10-14

27
Power/ground Noise Immunity Test in Wireless and High-speed UWB Communication System

Kim, Joungho; Yoon, Changwook; Park, Hyunjeong; Lee, Woojin; Shin, Minchul; Pak, Jun So, IEEE Electromagnetic Compatibility Symposium, EMC, pp.1 - 6, 123, 2007-12

28
Prediction and Verification of Power/Ground Plane Edge Radiation Excited by Through-Hole Signal Via Based on Balanced TLM and Via Coupling Model

Pak, Jun So; Lee, Junwoo; Kim, Hyungsoo; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.181 - 184, IEEE, 2003-10-27

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