Results 21-30 of 35 (Search time: 0.005 seconds).
NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Design of LTCC-based ultra-wideband transmitter SiP using CMOS impulse generator Yoon, C.; Lee, J.; Kim, M.; Park, Y.; Park, H.; Lee, H.; Kim, Joungho, 8th Electronics Packaging Technology Conference, EPTC 2006, pp.85 - 89, IEEE, 2006-12-06 | |
Estimation of data-dependent jitter using single pulse analysis method in high-speed differential signaling Song, E.; Lee, J.; Kim, J.; Kam, D.G.; Ryu, C.; Kim, Joungho, ESTC 2006 - 1st Electronics Systemintegration Technology Conference, pp.741 - 746, IEEE, 2006-09-05 | |
Active circuit to through silicon via (TSV) noise coupling Cho, J.; Shim, J.; Song, E.; Pak, J.S.; Lee, J.; Lee, H.; Kim, Joungho, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.97 - 100, IEEE, 2009-10-19 | |
Modeling and measurement of radiated emission through a cutout on the power/ground plane Lee, J.; Kang, J.; Park, K.; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.776 - 780, IEEE, 2006-08-14 | |
Sharing power distribution networks for enhanced power integrity by using through-silicon-via Pak, J.S.; Kim, Joungho; Lee, J.; Lee, H.; Park, K.; Kim, J., 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.9 - 12, IEEE, 2008-12-10 | |
Slow wave and dielectric quasi-TEM modes of metal-insulator-semiconductor (MIS) structure through silicon via (TSV) in signal propagation and power delivery in 3D chip package Pak, Jun So; Cho, J.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 60th Electronic Components and Technology Conference, ECTC 2010, pp.667 - 672, ECTC 2010, 2010-06-01 | |
Reduction of cavity-to-cavity power/ground noise coupling through plane cutout in multi-layer PCBs Lee, J.; Kim, M.; Kim, Joungho; Rotaru, M.D.; Iyer, M.K., 2004 IEEE International Symposium on Electromagnetic Compatibility, EMC 2004, pp.35 - 38, IEEE, 2004-08-09 | |
Efficiency of differential signaling on cavity noise suppression in applications with refernce plane change Lee, J.; Kim, J.; Kim, Joungho; Lu, A.C.W.; Fan, W.; Wai, L.L., IEEE International Symposium on Electromagnetic Compatibility, 2004, pp.203 - 208, IEEE, 2004-08-09 | |
Characterization of high-frequency plane-to-plane coupling through cutout in multi-layer packages Lee, J.; Seng, Y.M.; Rotaru, M.D.; Iyer, M.K.; Kim, Joungho, 53rd Electronic Components and Technology Conference 2003, pp.1589 - 1593, IEEE, 2003-05-27 | |
System-on-Package ultra wideband transmitter with integrated bandpass filter and broad band planar antenna Kim, M.; Lee, J.; Park, Y.-J.; Kim, Joungho, 55th Electronic Components and Technology Conference, ECTC, pp.541 - 544, IEEE, 2005-05-31 |