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Results 21-30 of 46 (Search time: 0.006 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
21
Extraction of equivalent inductance in package-PCB hierarchical power distribution network

Kim, J.; Kim, J.; Ren, L.; Fan, J.; Kim, Jounghoresearcher; Drewniak, J.L., 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.109 - 112, IEEE, 2009-10-19

22
Slow wave and dielectric quasi-TEM modes of metal-insulator-semiconductor (MIS) structure through silicon via (TSV) in signal propagation and power delivery in 3D chip package

Pak, Jun So; Cho, J.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 60th Electronic Components and Technology Conference, ECTC 2010, pp.667 - 672, ECTC 2010, 2010-06-01

23
Impact of partial EBG PDN on PI, SI and lumped model-based correlation

Lee, J.; Lee, H.; Park, K.; Chung, B.; Kim, J.; Kim, Jounghoresearcher, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.168 - 171, 2008-05-19

24
Modeling and analysis of die-to-die vertical coupling in 3-D IC

Lee, S.; Kim, G.; Kim, J.; Song, T.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.707 - 711, 2009-12-09

25
Guard ring effect for Through Silicon Via (TSV) noise coupling reduction

Cho, J.; Yoon, K.; Pak, J.S.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24

26
An estimation method of chip level power distribution network inductance using full wave simulation and segmentation method

Kim, J.; Shim, J.; Lee, W.; Pak, J.S.; Kim, Jounghoresearcher, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.339 - 342, 2008-05-19

27
Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC

Kim, J.; Pak, J.S.; Cho, J.; Lee, J.; Lee, H.; Park, K.; Kim, Jounghoresearcher, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24

28
A precise analytical eye-diagram estimation method for non-ideal high-speed channels

Cho, J.; Song, E.; Shim, J.; Kim, J.; Kim, Jounghoresearcher, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.159 - 162, IEEE, 2009-10-19

29
Separated role of on-chip and on-PCB decoupling capacitors for reduction of radiated emission on printed circuit board

Kim, J.; Choi, B.; Kim, H.; Ryu, W.; Yun, Y.-H.; Ham, S.-H.; Lee, Y.-H.; Kim, Jounghoresearcher, 2001 International Symposium on Electromagnetic Compatibility, v.1, pp.531 - 536, IEEE, 2001-08-13

30
Noise isolation in LTCC-based X/Ku-band transceiver SiP using double-stacked electromagnetic bandgap structure

Park, J.; Kim, J.; Lu A.C.W.; Shim, Y.; Kim, Jounghoresearcher, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, IEEE, 2007-07-09

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