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Results 11-20 of 46 (Search time: 0.006 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
11
TSV modeling and noise coupling in 3D IC

Kim, Jounghoresearcher; Cho, J.; Kim, J., 3rd Electronics System Integration Technology Conference, ESTC 2010, ESTC 2010, 2010-09-13

12
Controlled power/ground noise on multi-layer digital printed circuit board using adaptive CMOS output driving scheme

Kim, H.; Ryu, W.; Kim, J.; Kim, Jounghoresearcher, 2001 International Symposium on Electromagnetic Compatibility, v.2, pp.921 - 926, IEEE, 2001-08-13

13
Analysis of power distribution network in TSV-based 3D-IC

Kim, K.; Lee, W.; Kim, J.; Song, T.; Kim, J.; Pak, J.S.; Kim, Jounghoresearcher; Lee, H.; Kwon, Y.; Park, K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.177 - 180, IEEE, 2010-10-25

14
A chip-package hybrid DLL loop and clock distribution network for low-jitter clock delivery

Chung, D.; Ryu, C.; Kim, H.; Lee, C.; Kim, J.; Kim, J.; Bae, K.; Yu, J.; Lee, S.; Yoo, H.; Kim, Jounghoresearcher, 2005 IEEE International Solid-State Circuits Conference, ISSCC, v.48, pp.514 - 614, 2005-02-06

15
I/O power estimation and analysis of high-speed channels in Through-Silicon Via (TSV)-based 3D IC

Kim, Jounghoresearcher; Cho, J.; Pak, J.S.; Song, T.; Kim, J.; Lee, H.; Lee, J.; Park, K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.41 - 44, IEEE, 2010-10-25

16
Experimental investigation of radiated emission from flexible printed circuit (FPC) cable

Ahn, S.; Kim, J.; Lee, H.; Kim, Jounghoresearcher; Byun, J.-G.; Choi, C.-S.; Hwang, H.-J., IEEE International Symposium on Electromagnetic Compatibility, 2002, v.2, pp.883 - 888, IEEE, 2002-08-19

17
Analytical modeling of power distribution network with embedded electromagnetic bandgap structure

Hwang, C.; Kim, J.; Shim, Y.; Kim, Jounghoresearcher, 2009 IEEE International Symposium on Electromagnetic Compatibility, EMC 2009, pp.69 - 73, IEEE, 2009-08-17

18
Signal quality test with 3-dimensional BER opening for non-coherent Ultra Wide-Band (UWB) System-in-Package (SiP)

Yoon, C.; Kim, Jounghoresearcher; Kim, J., 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009-12-02

19
Through silicon via (TSV) equalizer

Kim, Jounghoresearcher; Song, E.; Cho, J.; Pak, J.S.; Lee, J.; Lee, H.; Kim, J., 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.13 - 16, 2009-10-19

20
Through Silicon Via (TSV) shielding structures

Cho, J.; Kim, Jounghoresearcher; Song, T.; Pak, J.S.; Kim, J.; Lee, H.; Lee, J.; Park K., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.269 - 272, IEEE, 2010-10-25

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