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Results 31-40 of 46 (Search time: 0.008 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Extraction of equivalent inductance in package-PCB hierarchical power distribution network Kim, J.; Kim, J.; Ren, L.; Fan, J.; Kim, Joungho; Drewniak, J.L., 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.109 - 112, IEEE, 2009-10-19 | |
| Slow wave and dielectric quasi-TEM modes of metal-insulator-semiconductor (MIS) structure through silicon via (TSV) in signal propagation and power delivery in 3D chip package Pak, Jun So; Cho, J.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 60th Electronic Components and Technology Conference, ECTC 2010, pp.667 - 672, ECTC 2010, 2010-06-01 | |
| Chip-package co-modeling & verification of noise coupling & generation in CMOS DC/DC buck converter Song, T.; Kim, J.; Pak, J.; Kim, Joungho, 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009, pp.285 - 288, IEEE, 2009-01-12 | |
| Efficiency of differential signaling on cavity noise suppression in applications with refernce plane change Lee, J.; Kim, J.; Kim, Joungho; Lu, A.C.W.; Fan, W.; Wai, L.L., IEEE International Symposium on Electromagnetic Compatibility, 2004, pp.203 - 208, IEEE, 2004-08-09 | |
| Suppressed carrier clock for reduction of electromagnetic radiated emission from high-speed digital system Kam, D.G.; Kim, Joungho; Kim, J.; Jun, P., 2003 IEEE Symposium on Electromagnetic Compatibility, pp.394 - 397, IEEE, 2003-08-18 | |
| 10Gbps backplane design methodology with sensitivity analysis and statistical analysis Kim, J.; Baek, S.; Park, H.; Kim, S.; Hong, Y.; Lim, D.; Kim, Joungho, 7th Electronics Packaging Technology Conference, EPTC 2005, pp.38 - 42, IEEE, 2005-12-07 | |
| Accurate high frequency lossy model of differential signal line including mode-conversion and common-mode propagation effect Baek, S.; Ahn, S.; Park, J.; Kim, Joungho; Kim, J.; Cho, J.-H., 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.562 - 566, IEEE, 2004-08-09 | |
| Coupling of simultaneous switching noise to interconnecting lines in high-speed systems Kim, J.; Rotaru, M.D.; Chong, K.C.; Park, J.; Iyer, M.K.; Kim, Joungho, 2004 Proceedings - 54th Electronic Components and Technology Conference, pp.568 - 574, IEEE, 2004-06-01 | |
| Separated role of on-chip and on-PCB decoupling capacitors for reduction of radiated emission on printed circuit board Kim, J.; Choi, B.; Kim, H.; Ryu, W.; Yun, Y.-H.; Ham, S.-H.; Lee, Y.-H.; Kim, Joungho, 2001 International Symposium on Electromagnetic Compatibility, pp.531 - 536, IEEE, 2001-08-13 | |
| Experimental investigation of radiated emission from flexible printed circuit (FPC) cable Ahn, S.; Kim, J.; Lee, H.; Kim, Joungho; Byun, J.-G.; Choi, C.-S.; Hwang, H.-J., IEEE International Symposium on Electromagnetic Compatibility, 2002, pp.883 - 888, IEEE, 2002-08-19 |