Search
Results 21-30 of 35 (Search time: 0.007 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Electrical Performance of High Bandwidth Memory (HBM) Interposer Channel in Terabyte/s Bandwidth Graphics Module Kim, Joungho; Cho, Kyungjun; Kim, Heegon; Choi, Sumin; Lim, Jaemin, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31 | |
| A Fast Statistical Eye-diagram Estimation Method including Internal PDN Noise of Pseudo-differential Receiver Buffer Kim, Joungho; Kim, Heegon; Choi, Sumin; Kim, Jonghoon J; Jung, Daniel H; Lee, Hyunuk; Cho, Kyungjun, IEEE Electrical Design of Advanced Packaging & System Symposium, IEEE Electrical Design of Advanced Packaging & System Symposium, 2015-12-15 | |
| Modeling and Analysis of Defects in Through Silicon Via Channel for Non-invasive Fault Isolation Kim, Joungho; Kim, Heegon; Kim, Jonghoon J; Kim, Sukjin; Bae, Hyun-Cheol; Choi, Kwang-Seong, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31 | |
| Design of Crosstalk Compensation Passive Equalizers for High-speed Differential Signaling on 2.5D-IC Interposer Kim, Joungho; Choi, Sumin; Kim, Heegon; Kim, Sukjin; Jung, Daniel H; Lee, Junho; Park, Kunwoo, 2013 IEEE Electrical Design of Advanced Package & Systems Symposium , pp.253 - 256, 2013 IEEE Electrical Design of Advanced Package & Systems Symposium, 2013-12-13 | |
| Modeling and Analysis of Open Defect in Through Silicon Via (TSV) Channel Kim, Joungho; Jung, Daniel H; Kim, Heegon; Kim, Jonghoon J; Bae, Hyun-Cheol; Choi, Kwangseong, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.163 - 166, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 | |
| Power Distribution Network (PDN) Design and Analysis of A Single and. Double-Sided High Bandwidth Memory (HBM) Interposer for 2.5D Terabtye/s Bandwidth System Cho, Kyungjun; Kim, Joungho; Kim, Youngwoo; Kim, Subin; Lee, Hyunsuk; Choi, Sumin; Kim, Heegon, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 | |
| Signal Integrity of Bump-less High-speed Through Silicon Via Channel for Terabyte/s Bandwidth 2.5D IC Lee, Hyunsuk; Kim, Joungho; Kim, Heegon; Choi, Sumin; Lim, Jaemin; Cho, Kyungjun; Jeon, Yeseul, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31 | |
| Design and Analysis of Power Distribution Network (PDN) for High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module Kim, Joungho; Cho, Kyungjun; Kim, Youngwoo; Lee, Hyungsuk; Kim, Heegon; Cho, Sumin; Kim, Subin, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-06-01 | |
| Design of an On-interposer Passive Equalizer for High Bandwidth Memory (HBM) with 30Gbps Data Transmission Jeon, Yeseul; Kim, Joungho; Kim, Heegon; Choi, Sumin; Kim, Youngwoo, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31 | |
| Eye-diagram Estimation and Analysis of High-Bandwidth Memory (HBM) Interposer Channel with Crosstalk Reduction Schemes on 2.5D and 3D IC Choi, Sumin; Kim, Joungho; Kim, Heegon; Kim, Jonghoon J; Lim, Jaemin; Lee, Hyunsuk; Cho, Kyungjun, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 |