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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| A Novel Through Mold Plate (TMP) for Signal and Thermal Integrity Improvement of High Bandwidth Memory (HBM) Son, Keeyoung; Kim, Subin; Park, Hyunwook; Kim, Seongguk; Kim, Keunwoo; Park, Shinyoung; Sim, Boogyo; Jeong, Seungtaek; Park, Gapyeol; Kim, Joungho, IEEE-MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), IEEE, 2020-12 | |
| Convolutional Neural Network-based Fast and Accurate Irregular Shape Power/Ground Plane Impedance Estimation Method for High-Speed Signaling Kim, Keunwoo; Lho, Daehwan; Park, Hyunwook; Son, Keeyoung; Kim, Seongguk; Park, Shinyoung; Sim, Boogyo; Kim, Subin; Kim, Joungho, IEEE-MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), IEEE, 2020-12 | |
| Reinforcement Learning-based Auto-router considering Signal Integrity Kim, Minsu; Park, Hyunwook; Kim, Seongguk; Son, Keeyoung; Kim, Subin; Son, Kyunjune; Choi, Seonguk; Park, Gapyeol; Kim, Joungho, 29th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2020, IEEE, 2020-10 | |
| PAM-4 based PCIe 6.0 Channel Design Optimization Method using Bayesian Optimization Kim, Jihun; Kim, Joungho; Park, Hyunwook; Kim, SeongGuk; Choi, Seonguk; Son, Keeyoung; Park, Joonsang; Kim, Haeyeon; Song, Jinwook, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Imitation Learning for Simultaneous Escape Routing Kim, Minsu; Kim, Joungho; Park, Hyunwook; Son, Keeyoung; Kim, SeongGuk; Kim, Haeyeon; Song, Jinwook, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Crosstalk-included PAM-4 Worst Eye Diagram Estimation Method for High-speed Serial Links Park, Hyunwook; Kim, Joungho; Kim, Keunwoo; Sim, BooGyo; Lho, Daehwan; Shin, TaeIn; Son, Keeyoung; Song, Jinwook, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Sequential Policy Network-based Optimal Passive Equalizer Design for an Arbitrary Channel of High Bandwidth Memory using Advantage Actor Critic Choi, Seonguk; Kim, Joungho; Park, Hyunwook; Son, Keeyoung; Kim, SeongGuk; Park, Joonsang; Kim, Haeyeon; Shin, TaeIn; Kim, Keunwoo, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Design and Analysis of HDMI 2.1 Connector for Crosstalk Reduction using Tabs and Inverse Tabs Lho, Daehwan; Kim, Joungho; Park, Hyunwook; Park, Gap Yeol; Park, Joonsang; Son, Kyungjune; Sim, BooGyo; Kang, Hyungmin; Kim, SeongGuk; Shin, TaeIn; Kim, Keunwoo; Son, Keeyoung, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Deep Reinforcement Learning-based Pin Assignment Optimization of BGA Packages considering Signal Integrity with Graph Representation Park, Joonsang; Kim, Joungho; Kim, SeongGuk; Son, Keeyoung; Shin, TaeIn; Park, Hyunwook; Choi, Seonguk; Kim, Haeyeon; Kim, Keunwoo, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Signal Integrity Analysis of High Speed Channel considering Thermal Distribution Son, Keeyoung; Kim, Joungho; Kim, SeongGuk; Lho, Daehwan; Kim, Keunwoo; Park, Hyunwook; Park, Gap Yeol, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 |
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