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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Analysis on Via Design for Impedance Mismatch Minimization in High Speed Channel Lim, Jaemin; Kim, Joungho; Kim, Heegon; Kim, Dong-Hyun; Jeon, Yeseul; Koh, Wee Jin; Chang Weng Yew Richard, Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), 2016-05-19 | |
| Analysis of Vertical PCB Connector Induced Via Stub Reduction in High Speed Serial Link Kim, Dong-Hyun; Kim, Joungho; Kim, Heegon; Lim, Jaemin; Jeon, Yeseul; Koh, Wee Jin; Chang, Weng Yew Richard, Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), 2016-05-19 | |
| Signal integrity analysis of vertical dual port coaxial connector for automotive system Kim, Dong-Hyun; Lee, Hyunsuk; Kim, Hongseok; Kim, Jonghoon; Kim, Joungho; Park, Jung-Min; Kim, Ji-Min; Lee, Kyung-Nam; Woo, Jong-Hoon; Kwon, Hyeok-Cheol; Kim, Hoon, 25th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2016, pp.165 - 167, Institute of Electrical and Electronics Engineers Inc., 2016-10 | |
| EMI Reduction in Wireless Power Transfer System Using Spread Spectrum Frequency Dithering Kim, Hongseok; Kim, Joungho; Kim, Jonghoon; Jeong, Seungtaek; Lee, Seongsoo; Cho, Yeonje; Kim, Dong-Hyun, IEEE Wireless Power Transfer Conference 2016, IEEE Wireless Power Transfer Conference 2016, 2016-05-06 | |
| Electromagnetic Interference on Analog-to-Digital Converters from High-Power Wireless Power Transfer System for Automotive Charger Kong, Sunkyu; Kim, Joungho; Bae, Bumhee; Kim, Dong-Hyun; Kim, Hongseok; Song, Chiuk, IEEE International Conference on Electromagnetic Compatibility (EMC 2016), IEEE International Conference on Electromagnetic Compatibility (EMC 2016), 2016-07-27 |
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