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Results 1-8 of 8 (Search time: 0.005 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Design and Analysis of On-interposer Active Power Dsitribution Network for an Efficient Simultaneous Switching Noise

Kim, Joungho; Cho, Kyungjun; Song, Jinwook, IEEE International Conference on 3D Systems Integration (3D IC 2016), IEEE International Conference on 3D Systems Integration (3D IC 2016), 2016-11-11

2
Analysis of Shifting in Self-Resonance Frequency of Flexible Coil for Wireless Power Transfer

Jeong, Seungtaek; Kim, Joungho; Song, Jinwook; Kim, Hongseok; Song, Chiuk; Kim, SukJin; Lee, Seongsoo, Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), 2016-05-20

3
PCB-package to Chip Wireless Power Transfer Scheme using Magnetic-field Resonance Coupling for High-density 3-D IC

Song, Jinwook; Kim, Joungho; Jeong, Seungtaek; Park, Shinyoung; Kim, Jonghoon; Cho, Yeonje, IEEE Wireless Power Transfer Conference 2016, IEEE Wireless Power Transfer Conference 2016, 2016-05-05

4
Audio frequency ground integrity modeling and measurement for a TDMA smartphone system

Park, Shinyoung; Song, Jinwook; Kim, Subin; Lee, Man Ho; Kim, Jonghoon; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, pp.3 - 5, Institute of Electrical and Electronics Engineers Inc., 2016-12

5
Probe Card Design with Signal and Power Integrity for Wafer-level Application Processor Test in LPDDR Channel

Kim, Joungho; Song, Jinwook; Lee, Eunjung; Kim, Jonghoon; Park, Shinyoung; Park, Jeoung Keun; Park, Jong Hyun; Yoon, Hee Bang; Kim, Il; Nam, Seungki, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31

6
Electromagnetic Bandgap Design for Power Distribution Network Noise Isolation in the Glass Interposer

Kim, Joungho; Kim, Youngwoo; Song, Jinwook; Kim, Subin; Venky, Sundaram; Ao, Tummala; Cho, Jonghyun, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31

7
Hybrid Metamaterial with Zero and Negative Permeability to Enhance Efficiency in Wireless Power Transfer System

Kim, Joungho; Lee, Seongsoo; Jeong, Seungtaek; Kim, Hongseok; Song, Chiuk; Yoon, Kibum; Song, Jinwook; Kong, Sunkyu; Yun, Yeojin, IEEE Wireless Power Transfer Conference 2016, IEEE Wireless Power Transfer Conference 2016, 2016-05-05

8
Multi-layer Probe Card Design with Signal/Power Integrity for Wafer-level AP Test in LPDDR4 Channel

Song, Jinwook; Kim, Joungho; Lee, Eunjung; Kim, Jonghoon; Park, Shinyoung; Park, Jeoung Keun; Park, Jong Hyun; Yoon, Hee Bang; Kim, Il; Nam, Seungki, IEEE International Conference on Signal and Power Integrity (SIPI 2016), pp.547 - 552, Institute of Electrical and Electronics Engineers Inc., 2016-07-27

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