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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Signal Integrity Design and Analysis of a HDMI 2.1 Connector for Improved Electrical Characteristics Park, Hyunwook; Kim, Joungho; Park, Joonsang; Park, Gap Yeol; Lho, Daehwan; Sim, BooGyo; Kang, Hyungmin; Shin, TaeIn; Kim, SeongGuk; Choi, Seonguk, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13 | |
| Signal Integrity Design and Analysis of a Spiral Through-Silicon Via (TSV) Array Channel for High Bandwidth Memory (HBM) Kim, SeongGuk; Kim, Joungho; Shin, TaeIn; Park, Hyunwook; Lho, Daehwan; Son, Keeyoung; Kim, Keunwoo; Park, Joonsang; Choi, Seonguk; Kim, Haeyeon, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13 | |
| Learning Super-scale Microbump Pin Assignment Optimization for Real-world PCB Design with Graph Representation Park, Joonsang; Kim, Joungho; Choi, Seonguk; Kim, Haeyeon; Park, Hyunwook; Kim, SeongGuk; Shin, TaeIn, DesignCon 2022, IEEE, 2022-04-05 | |
| Wireless Memory Test: A Breakthrough Solution for Highly Reliable HBM Park, Hyunwook; Kim, Joungho; Kim, Subin; Kim, SeongGuk; Jeong, Seung Taek; Park, Gap Yeol, Designcon 2021, IEEE, 2021-08-17 | |
| Thermal Transmission Line: Smoothing Thermal Gradients and Lowering Temperature for Signal Integrity Improvement of HBM and 2.5D ICs Son, Keeyoung; Kim, Joungho; Kim, SeongGuk; Kim, Keunwoo; Park, Hyunwook; Shin, TaeIn; Choi, Seonguk; Park, Joonsang; Kim, Minsu; Kim, Haeyoen, DesignCon 2022, IEEE, 2022-04-07 | |
| Neural Language Model Enables Extremely Fast and Robust Routing on Interposer Kim, Minsu; Kim, Joungho; Park, Hyunwook; Choi, Seonguk; Kim, Haeyeon; Kim, SeongGuk; Son, Keeyoung; Kim, Keunwoo; Lho, Daehwan, Designcon 2021, IEEE, 2021-08-17 | |
| Learning Collarative Policies to Solve NP-hard Routing Problems Kim, Minsu; Kim, Joungho; Park, Jinkyoo, 35th Conference on Neural Information Processing Systems, NeurIPS 2021, Neural Information Processing Systems Foundation, 2021-12-06 | |
| Imitation Learning with Bayesian Exploration (IL-BE) for Signal Integrity (SI) of PAM-4 based High-speed Serial Link: PCIe 6.0 Kim, Jihun; Kim, Joungho; Park, Hyunwook; Yoon, Jiwon; Choi, Seonguk; Park, Joonsang; Kim, HaeYeon; Son, Keeyoung; Kim, SeongGuk; Lho, Daehwan; Kim, Keunwoo; Song, Jinwook, DesignCon 2022, DesignCon, 2022-04-05 | |
| Deep Reinforcement Learning-based Channel-flexible Equalization Scheme: An Application to High Bandwidth Memory Choi, Seonguk; Kim, Joungho; Park, Hyunwook; Kim, Haeyeon; Park, Joonsang; Son, Keeyoung; Kim, SeongGuk; Kim, Keunwoo; Lho, Daehwan; Yoon, Jiwon; Song, Jinwook, DesignCon 2022, DesignCon, 2022-04-07 | |
| Modeling and Verification of a High Voltage Fuse for High Reliability and Safety in Electric Vehicle Kim, Subin; Shin, Taein; Jeong, Seungtaek; Kang, Hyungmin; Son, Keeyoung; Park, Shinyoung; Kim, Hyunho; Choi, Jaegi; Kim, Minkyu; Kim, Hoon; Kim, Joungho, 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.287 - 292, Institute of Electrical and Electronics Engineers Inc., 2020-07 |
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