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Results 1-10 of 30 (Search time: 0.007 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| A Novel Through Mold Plate (TMP) for Signal and Thermal Integrity Improvement of High Bandwidth Memory (HBM) Son, Keeyoung; Kim, Subin; Park, Hyunwook; Kim, Seongguk; Kim, Keunwoo; Park, Shinyoung; Sim, Boogyo; Jeong, Seungtaek; Park, Gapyeol; Kim, Joungho, IEEE-MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), IEEE, 2020-12 | |
| Convolutional Neural Network-based Fast and Accurate Irregular Shape Power/Ground Plane Impedance Estimation Method for High-Speed Signaling Kim, Keunwoo; Lho, Daehwan; Park, Hyunwook; Son, Keeyoung; Kim, Seongguk; Park, Shinyoung; Sim, Boogyo; Kim, Subin; Kim, Joungho, IEEE-MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), IEEE, 2020-12 | |
| A Processing-In-Memory on High Bandwidth Memory (PIM-HBM): Impact of interconnect Channels on System Performance in 2.5D/3D IC Park, Hyunwook; Kim, Joungho; Shin, TaeIn; Lho, Daehwan; Son, Keeyoung; Kim, Keunwoo; Park, Joonsang, DesignCon 2022, IEEE, 2022-04-05 | |
| A New Challenge for Neuromorphic Computing System: from Off-chip Interconnects to On-chip Interconnects Park, Hyunwook; Kim, Joungho; Kim, SeongGuk; Kim, Keunwoo; Son, Keeyoung, DesignCon 2022, IEEE, 2022-04-05 | |
| Deterministic Policy-based Reinforcement Learning Method for Optimization method Lho, Daehwan; Kim, Joungho; Park, Hyunwook; Kim, Keunwoo; Kim, SeongGuk; Sim, BooGyo; Son, Kyungjune; Son, Keeyoung; Park, Joonsang; Kim, Haeyeon, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-11 | |
| Low EMI Board-to-board Connector Design for 5G mmWave and High-speed Signaling Kim, Keunwoo; Kim, Joungho; Lee, Junghyun; Hong, Seokwoo; Sim, BooGyo; Son, Kyungjune; Shin, TaeIn; Son, Keeyoung, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-12 | |
| Crosstalk-included PAM-4 Worst Eye Diagram Estimation Method for High-speed Serial Links Park, Hyunwook; Kim, Joungho; Kim, Keunwoo; Sim, BooGyo; Lho, Daehwan; Shin, TaeIn; Son, Keeyoung; Song, Jinwook, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Sequential Policy Network-based Optimal Passive Equalizer Design for an Arbitrary Channel of High Bandwidth Memory using Advantage Actor Critic Choi, Seonguk; Kim, Joungho; Park, Hyunwook; Son, Keeyoung; Kim, SeongGuk; Park, Joonsang; Kim, Haeyeon; Shin, TaeIn; Kim, Keunwoo, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Design and Analysis of HDMI 2.1 Connector for Crosstalk Reduction using Tabs and Inverse Tabs Lho, Daehwan; Kim, Joungho; Park, Hyunwook; Park, Gap Yeol; Park, Joonsang; Son, Kyungjune; Sim, BooGyo; Kang, Hyungmin; Kim, SeongGuk; Shin, TaeIn; Kim, Keunwoo; Son, Keeyoung, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Deep Reinforcement Learning-based Pin Assignment Optimization of BGA Packages considering Signal Integrity with Graph Representation Park, Joonsang; Kim, Joungho; Kim, SeongGuk; Son, Keeyoung; Shin, TaeIn; Park, Hyunwook; Choi, Seonguk; Kim, Haeyeon; Kim, Keunwoo, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 |
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