Results 1-10 of 17 (Search time: 0.004 seconds).
NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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A Processing-In-Memory on High Bandwidth Memory (PIM-HBM): Impact of interconnect Channels on System Performance in 2.5D/3D IC Park, Hyunwook; Kim, Joungho; Shin, TaeIn; Lho, Daehwan; Son, Keeyoung; Kim, Keunwoo; Park, Joonsang, DesignCon 2022, IEEE, 2022-04-05 | |
A New Challenge for Neuromorphic Computing System: from Off-chip Interconnects to On-chip Interconnects Park, Hyunwook; Kim, Joungho; Kim, SeongGuk; Kim, Keunwoo; Son, Keeyoung, DesignCon 2022, IEEE, 2022-04-05 | |
Imitate Expert Policy and Learn Beyond: A Practical PDN Optimizer by Imitation Learning Choi, Seonguk; Kim, Joungho; Park, Joonsang; Son, Keeyoung; Park, Hyunwook, DesignCon 2022, IEEE, 2022-04-05 | |
Deterministic Policy-based Reinforcement Learning Method for Optimization method Lho, Daehwan; Kim, Joungho; Park, Hyunwook; Kim, Keunwoo; Kim, SeongGuk; Sim, BooGyo; Son, Kyungjune; Son, Keeyoung; Park, Joonsang; Kim, Haeyeon, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-11 | |
Low EMI Board-to-board Connector Design for 5G mmWave and High-speed Signaling Kim, Keunwoo; Kim, Joungho; Lee, Junghyun; Hong, Seokwoo; Sim, BooGyo; Son, Kyungjune; Shin, TaeIn; Son, Keeyoung, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-12 | |
Learning Super-scale Microbump Pin Assignment Optimization for Real-world PCB Design with Graph Representation Park, Joonsang; Kim, Joungho; Choi, Seonguk; Kim, Haeyeon; Park, Hyunwook; Kim, SeongGuk; Shin, TaeIn, DesignCon 2022, IEEE, 2022-04-05 | |
Thermal Transmission Line: Smoothing Thermal Gradients and Lowering Temperature for Signal Integrity Improvement of HBM and 2.5D ICs Son, Keeyoung; Kim, Joungho; Kim, SeongGuk; Kim, Keunwoo; Park, Hyunwook; Shin, TaeIn; Choi, Seonguk; Park, Joonsang; Kim, Minsu; Kim, Haeyoen, DesignCon 2022, IEEE, 2022-04-07 | |
Imitation Learning with Bayesian Exploration (IL-BE) for Signal Integrity (SI) of PAM-4 based High-speed Serial Link: PCIe 6.0 Kim, Jihun; Kim, Joungho; Park, Hyunwook; Yoon, Jiwon; Choi, Seonguk; Park, Joonsang; Kim, HaeYeon; Son, Keeyoung; Kim, SeongGuk; Lho, Daehwan; Kim, Keunwoo; Song, Jinwook, DesignCon 2022, DesignCon, 2022-04-05 | |
Deep Reinforcement Learning-based Channel-flexible Equalization Scheme: An Application to High Bandwidth Memory Choi, Seonguk; Kim, Joungho; Park, Hyunwook; Kim, Haeyeon; Park, Joonsang; Son, Keeyoung; Kim, SeongGuk; Kim, Keunwoo; Lho, Daehwan; Yoon, Jiwon; Song, Jinwook, DesignCon 2022, DesignCon, 2022-04-07 | |
Design and Analysis of Hierarchical Power Distribution Network (PDN) for Full Wafer Scale Chip (FWSC) Module Kim, Hyunwoo; Park, Joonsang; Son, Keeyoung; Kim, Joungho; Kim, Haeyeon; Park, Hyunwook; Shin, TaeIn; Kim, Keunwoo; Yoon, Jiwon; Lee, Junghyun; Hong, Jonghyun; Kim, Juneyoung, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, IEEE, 2022-12-13 |
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