Search
Results 21-30 of 33 (Search time: 0.006 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Modeling and Verification of a High Voltage Fuse for High Reliability and Safety in Electric Vehicle Kim, Subin; Shin, Taein; Jeong, Seungtaek; Kang, Hyungmin; Son, Keeyoung; Park, Shinyoung; Kim, Hyunho; Choi, Jaegi; Kim, Minkyu; Kim, Hoon; Kim, Joungho, 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.287 - 292, Institute of Electrical and Electronics Engineers Inc., 2020-07 | |
| Deep Reinforcement Learning-based Interconnection Design for 3D X-Point Array Structure Considering Signal Integrity Son, Kyungjune; Kim, Minsu; Park, Hyunwook; Park, Shinyoung; Park, Gap Yeol; Lho, Daewhan; Kim, Seoungguk; Shin, Taein; Son, Keeyoung; Kim, Keunwoo; Kim, Joungho, 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 | |
| Deep Neural Network-based Lumped Circuit Modeling using Impedance Curve Lho, Daehwan; Park, Hyunwook; Kim, Seongguk; Shin, Taein; Kim, Keunwoo; Son, Kyungjune; Kang, Hyungmin; Sim, Boogyo; Son, Keeyoung; Kim, Minsu; Kim, Joungho, 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 | |
| Policy Gradient Reinforcement Learning-based Optimal Decoupling Capacitor Design Method for 2.5-D/3-D ICs using Transformer Network Park, Hyunwook; Kim, Minsu; Kim, Subin; Jeong, Seungtaek; Kim, Seongguk; Kang, Hyungmin; Kim, Keunwoo; Son, Keeyoung; Park, Gapyeol; Son, Kyungjune; Shin, Taein; Kim, Joungho, 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 | |
| Deep Reinforcement Learning-based through Silicon Via (TSV) Array Design Optimization Method considering Crosstalk Kim, Keunwoo; Park, Hyunwook; Lho, Daehwan; Kim, Minsu; Son, Keeyoung; Son, Kyungjune; Kim, Seongguk; Shin, Taein; Choi, Seonguk; Kim, Joungho, 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 | |
| An Induction Heating System Analysis Method based on Operating Conditions Kang, Hyungmin; Lho, Daehwan; Park, Hyunwook; Kong, Taewoong; Choi, Hyojin; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.478 - 481, Institute of Electrical and Electronics Engineers Inc., 2020-07 | |
| Modeling and Demonstration of Hardware-based Deep Neural Network (DNN) Inference using Memristor Crossbar Array considering Signal Integrity Shin, Taein; Park, Shinyoung; Kim, Seongguk; Park, Hyunwook; Lho, Daehwan; Kim, Subin; Son, Kyungjune; Park, Gapyeol; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.417 - 421, Institute of Electrical and Electronics Engineers Inc., 2020-07 | |
| A deep neural network-based estimation of efficiency enhancement by an intermediate coil in automotive wireless power transfer system Sim, Boogyo; Lho, Daehwan; Park, Dongryul; Lee, Seongsoo; Jeong, Seung Taek; Kim, Hongseok; Park, Hyunwook; Kang, Hyungmin; Hong, Seokwoo; Kim, Joungho, 2020 IEEE Wireless Power Transfer Conference, WPTC 2020, pp.231 - 233, Institute of Electrical and Electronics Engineers Inc., 2020-11 | |
| A Deep Neural Network-based Estimation of EMI Reduction by an Intermediate Coil in Automotive Wireless Power Transfer System Sim, Boogyo; Lho, Daehwan; Park, Dongryul; Park, Hyunwook; Kang, Hyungmin; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.407 - 410, Institute of Electrical and Electronics Engineers Inc., 2020-07 | |
| Design and Analysis of Thermal Transmission Line based Embedded Cooling Structures for High Bandwidth Memory Module and 2.5D/3D ICs Son, Keeyoung; Kim, Subin; Park, Shinyoung; Park, Hyunwook; Kim, Keunwoo; Shin, Taein; Kim, Minsu; Son, Kyungjune; Park, Gap Yeol; Jeong, Seung Taek; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 |