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Results 21-30 of 42 (Search time: 0.005 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Learning Super-scale Microbump Pin Assignment Optimization for Real-world PCB Design with Graph Representation Park, Joonsang; Kim, Joungho; Choi, Seonguk; Kim, Haeyeon; Park, Hyunwook; Kim, SeongGuk; Shin, TaeIn, DesignCon 2022, IEEE, 2022-04-05 | |
| Wireless Memory Test: A Breakthrough Solution for Highly Reliable HBM Park, Hyunwook; Kim, Joungho; Kim, Subin; Kim, SeongGuk; Jeong, Seung Taek; Park, Gap Yeol, Designcon 2021, IEEE, 2021-08-17 | |
| Thermal Transmission Line: Smoothing Thermal Gradients and Lowering Temperature for Signal Integrity Improvement of HBM and 2.5D ICs Son, Keeyoung; Kim, Joungho; Kim, SeongGuk; Kim, Keunwoo; Park, Hyunwook; Shin, TaeIn; Choi, Seonguk; Park, Joonsang; Kim, Minsu; Kim, Haeyoen, DesignCon 2022, IEEE, 2022-04-07 | |
| Neural Language Model Enables Extremely Fast and Robust Routing on Interposer Kim, Minsu; Kim, Joungho; Park, Hyunwook; Choi, Seonguk; Kim, Haeyeon; Kim, SeongGuk; Son, Keeyoung; Kim, Keunwoo; Lho, Daehwan, Designcon 2021, IEEE, 2021-08-17 | |
| Imitation Learning with Bayesian Exploration (IL-BE) for Signal Integrity (SI) of PAM-4 based High-speed Serial Link: PCIe 6.0 Kim, Jihun; Kim, Joungho; Park, Hyunwook; Yoon, Jiwon; Choi, Seonguk; Park, Joonsang; Kim, HaeYeon; Son, Keeyoung; Kim, SeongGuk; Lho, Daehwan; Kim, Keunwoo; Song, Jinwook, DesignCon 2022, DesignCon, 2022-04-05 | |
| Deep Reinforcement Learning-based Channel-flexible Equalization Scheme: An Application to High Bandwidth Memory Choi, Seonguk; Kim, Joungho; Park, Hyunwook; Kim, Haeyeon; Park, Joonsang; Son, Keeyoung; Kim, SeongGuk; Kim, Keunwoo; Lho, Daehwan; Yoon, Jiwon; Song, Jinwook, DesignCon 2022, DesignCon, 2022-04-07 | |
| Deep Reinforcement Learning-based Interconnection Design for 3D X-Point Array Structure Considering Signal Integrity Son, Kyungjune; Kim, Minsu; Park, Hyunwook; Park, Shinyoung; Park, Gap Yeol; Lho, Daewhan; Kim, Seoungguk; Shin, Taein; Son, Keeyoung; Kim, Keunwoo; Kim, Joungho, 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 | |
| Deep Neural Network-based Lumped Circuit Modeling using Impedance Curve Lho, Daehwan; Park, Hyunwook; Kim, Seongguk; Shin, Taein; Kim, Keunwoo; Son, Kyungjune; Kang, Hyungmin; Sim, Boogyo; Son, Keeyoung; Kim, Minsu; Kim, Joungho, 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 | |
| Policy Gradient Reinforcement Learning-based Optimal Decoupling Capacitor Design Method for 2.5-D/3-D ICs using Transformer Network Park, Hyunwook; Kim, Minsu; Kim, Subin; Jeong, Seungtaek; Kim, Seongguk; Kang, Hyungmin; Kim, Keunwoo; Son, Keeyoung; Park, Gapyeol; Son, Kyungjune; Shin, Taein; Kim, Joungho, 2020 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 | |
| Design and Analysis of Hierarchical Power Distribution Network (PDN) for Full Wafer Scale Chip (FWSC) Module Kim, Hyunwoo; Park, Joonsang; Son, Keeyoung; Kim, Joungho; Kim, Haeyeon; Park, Hyunwook; Shin, TaeIn; Kim, Keunwoo; Yoon, Jiwon; Lee, Junghyun; Hong, Jonghyun; Kim, Juneyoung, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, IEEE, 2022-12-13 |
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