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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Sequential Policy Network-based Optimal Passive Equalizer Design for an Arbitrary Channel of High Bandwidth Memory using Advantage Actor Critic Choi, Seonguk; Kim, Joungho; Park, Hyunwook; Son, Keeyoung; Kim, SeongGuk; Park, Joonsang; Kim, Haeyeon; Shin, TaeIn; Kim, Keunwoo, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Deep Reinforcement Learning-based Pin Assignment Optimization of BGA Packages considering Signal Integrity with Graph Representation Park, Joonsang; Kim, Joungho; Kim, SeongGuk; Son, Keeyoung; Shin, TaeIn; Park, Hyunwook; Choi, Seonguk; Kim, Haeyeon; Kim, Keunwoo, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Signal Integrity Design and Analysis of a Spiral Through-Silicon Via (TSV) Array Channel for High Bandwidth Memory (HBM) Kim, SeongGuk; Kim, Joungho; Shin, TaeIn; Park, Hyunwook; Lho, Daehwan; Son, Keeyoung; Kim, Keunwoo; Park, Joonsang; Choi, Seonguk; Kim, Haeyeon, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13 |
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- 3 2021