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Results 1-1 of 1 (Search time: 0.003 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Elucidating the Mechanical Properties of Transparent Conductive Thin Films for Mechanically Reliable Microelectronics

Oh, Seung Jin; Choi, Kyung Cheol; Kwon, Jeong Hyun; Kim, Taek-Soo, The 21st International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2023-10-27

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