Browse "EE-Conference Papers(학술회의논문)" by Author Sim, BooGyo

Showing results 1 to 12 of 12

1
A Dual Resonance near Field Communication Coil for EMF Reduction in near Field Communication and Wireless Power Transfer Dual Coil System

Hong, Seokwoo; Jeong, Seung Taek; Lee, Seong Soo; Sim, BooGyo; Kim, Hongseok; Kim, Joungho, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019, pp.644 - 647, Institute of Electrical and Electronics Engineers Inc., 2019-07

2
A New Design Method of GDDR6 WCLK Using Reinforcement Learning for over 20Gbps

Park, Hyunwook; Kim, Joungho; Cho, Kyungjun; Sim, BooGyo; Kim, Subin; Jeong, Seung Taek, DesignCon 2021, IEEE, 2021-08-16

3
Crosstalk-included PAM-4 Worst Eye Diagram Estimation Method for High-speed Serial Links

Park, Hyunwook; Kim, Joungho; Kim, Keunwoo; Sim, BooGyo; Lho, Daehwan; Shin, TaeIn; Son, Keeyoung; et al, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17

4
Design and Analysis of Double-Eight Shaped Shielding Coil for Solenoid Coil in Loosely-Coupled Wireless Power Transfer System

Sim, BooGyo; Jeong, Seung Taek; Lee, Seongsoo; Hong, Seokwoo; Kim, Hongseok; Kim, Joungho, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019, pp.639 - 643, Institute of Electrical and Electronics Engineers Inc., 2019-07

5
Design and Analysis of HDMI 2.1 Connector for Crosstalk Reduction using Tabs and Inverse Tabs

Lho, Daehwan; Kim, Joungho; Park, Hyunwook; Park, Gap Yeol; Park, Joonsang; Son, Kyungjune; Sim, BooGyo; et al, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17

6
Deterministic Policy-based Reinforcement Learning Method for Optimization method

Lho, Daehwan; Kim, Joungho; Park, Hyunwook; Kim, Keunwoo; Kim, SeongGuk; Sim, BooGyo; Son, Kyungjune; et al, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-11

7
Intra-pair Skew Impact Analysis of High-speed Cables for HDMI Interface

Sim, BooGyo; Kim, Joungho; Kim, Keunwoo; Shin, TaeIn; Park, Hyunwook; Kim, SeongGuk; Lho, Daehwan; et al, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-10

8
Low EMI Board-to-board Connector Design for 5G mmWave and High-speed Signaling

Kim, Keunwoo; Kim, Joungho; Lee, Junghyun; Hong, Seokwoo; Sim, BooGyo; Son, Kyungjune; Shin, TaeIn; et al, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-12

9
Power Distribution Network Impedance Analysis considering Thermal Distribution

Son, Keeyoung; Kim, Joungho; Lho, Daehwan; Kim, Keunwoo; Choi, Seonguk; Kim, Haeyeon; Park, Hyunwook; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, IEEE, 2022-12-13

10
Scalable Transformer Network-based Reinforcement Learning Method for PSIJ Optimization in HBM

Park, Hyunwook; Kim, Joungho; Shin, TaeIn; Kim, SeongGuk; Lho, Daehwan; Sim, BooGyo; Song, Jinwook; et al, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-10

11
Signal Integrity and Power Leakage Optimization for 3D X-Point Memory Operation using Reinforcement Learning

Son, Kyungjune; Kim, Joungho; Kim, Keunwoo; Park, Gap Yeol; Lho, Daehwan; Park, Hyunwook; Sim, BooGyo; et al, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-11

12
Signal Integrity Design and Analysis of a HDMI 2.1 Connector for Improved Electrical Characteristics

Park, Hyunwook; Kim, Joungho; Park, Joonsang; Park, Gap Yeol; Lho, Daehwan; Sim, BooGyo; Kang, Hyungmin; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13

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