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Showing results 1 to 4 of 4

1
A Low-power and Real-time 3D Object Recognition Processor with Dense RGB-D Data Acquisition in Mobile Platforms

Im, Dongseok; Park, Gwangtae; Ryu, Junha; Li, Zhiyong; Kang, Sanghoon; Han, Donghyeon; Lee, Jinsu; et al, 25th IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS), IEEE, 2022-04

2
AI SoCs for AR/VR User-Interaction

Ryu, Junha; Im, DongSeok; Yoo, Hoi-Jun, 2021 IEEE International Electron Devices Meeting (IEDM), IEEE, 2021-12-11

3
DSPU: A 281.6mW Real-Time Deep Learning-Based Dense RGB-D Data Acquisition with Sensor Fusion and 3D Perception System-on-Chip

Im, DongSeok; Park, Gwangtae; Li, Zhiyong; Ryu, Junha; Kang, Sanghoon; Han, Donghyeon; Lee, Jinsu; et al, 2022 IEEE Hot Chips 34 Symposium, HCS 2022, Institute of Electrical and Electronics Engineers Inc., 2022-08

4
DSPU: A 281.6mW Real-Time Depth Signal Processing Unit for Deep Learning-Based Dense RGB-D Data Acquisition with Depth Fusion and 3D Bounding Box Extraction in Mobile Platforms

Im, DongSeok; Park, Gwangtae; LI, ZHIYONG; Ryu, Junha; Kang, Sanghoon; Han, Donghyeon; Lee, Jinsu; et al, 2022 IEEE International Solid-State Circuits Conference, ISSCC 2022, pp.510 - 512, Institute of Electrical and Electronics Engineers Inc., 2022-02

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