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1
Development and evaluation of 3-D SiP with vertically interconnected Through Silicon Vias (TSV)

Jang, DM; Ryu, C; Lee, KY; Cho, BH; Kim, Joungho; Oh, TS; Lee, Won-Jong; et al, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.847 - 852, IEEE, 2007-05-29

2
확장성을 가진 LTCC 기반의 Capacitor 모델

Kim, Joungho; Park, JB; Ryu, C; Shim, Y; Kim, Y; Lu, A.C.W.; Fan, W; et al, 한국군사과학기술학회 2006년 종합학술대회, 2006

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