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Analytical Model of Power/Ground Noise Coupling to Signal Traces in High-speed Multi-Layer Packages or Boards

Kim, Jingook; Rotaru, Mihai Dragos; Lee, Junwoo; Park, Jongbae; Alexander, Popov; layer, Mahadevan K.; Kim, Joungho, 5th IEEE Electronics Packaging Technology Conference, pp.45 - 50, IEEE, 2003-12

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