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Detection of open and short faults in 3D-ICs based on through silicon via (TSV)

Piersanti, Stefano; De Paulis, Francesco; Orlandi, Antonio; Jung, Daniel Hyunsuk; Kim, Joungho; Fan, Jun, IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017, pp.405 - 410, Institute of Electrical and Electronics Engineers Inc., 2017-08

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