Browse "EE-Conference Papers(학술회의논문)" by Author Kung, J

Showing results 1 to 1 of 1

1
Thermal signature: a simple yet accurate thermal index for floorplan optimization

Kung, J; Han, I; Sapatnekar, S; Shin, Youngsoo, 48th ACM/IEEE/EDAC Design Automation Conference (DAC), pp.108 - 113, ACM Special Interest Group on Design Automation (SIGDA), 2011-06-08

rss_1.0 rss_2.0 atom_1.0