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Showing results 1 to 4 of 4

1
10 GHz Differential Line Modeling of Leadframe-type TQFP Package for High-speed Serial Interconnection Systems

Ahn, Seungyoung; Kim, Tae Hong; Kim, Joungho, IEEE 7th Workshop on Signal Propagation on Interconnects, pp.43 - 46, IEEE, 2003

2
3 GHz Wide Frequency Model of Ferrite Bead for Power/Ground Noise Simulation of High-speed PCB

Kim, Joungho; Kim, Tae Hong; Lee, Junho; Kim, Hyungsoo, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.217 - 220, IEEE, 2002

3
3 GHz Wide Frequency Model of Surface Mount Technology (SMT) Ferrite Bead for Power/Ground and I/O Line Noise Simulation of High-speed PCB

Kim, Tae Hong; Kim, Hyungsoo; Pak, Jun So; Kim, Joungho, IEEE 7th Workshop on Signal Propagation on Interconnects, pp.181 - 284, IEEE, 2010-11-15

4
Design Comparison of I/O Port Ground and Power Plane for Enhanced ESD Immunity

Kim, Joungho; Lee, Junho; Kim, Tae Hong; Kim, Hyungsoo; Ryu, Woonghwan; Choi, Jae Chun, EMC Europe 2002 International Symposium on Electromagnetic Compatibility, 2002

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