Showing results 1 to 4 of 4
Bending Characteristics of Flexible Thin Film Encapsulation Prepared by Atomic Layer Deposition Choi, Kyung Cheol; Kim, E; Jang, C; Han, Y; Kim, K; Im, HG; Bae, BS, The 12th International Meeting on Information Display(IMID 2012), 2012-08-31 |
Design of Efficient Embedded System Lee, YJ; Song, J; Kim, BJ; Kim, E; Lim, G; Park, In-Cheol, IEEE International SoC Design Conference (ISOCC 2010) Chip Design Contest, IEEE, 2010-11 |
Development of an engineering test satellite, KITSAT-3 Sung, Dan Keun; Kim, E; Kim, S; Choi, SD, Euro_asia Space Week on Cooperation in Space, pp.453 - 457, Euro_asia Space Week on Cooperation in Space, 1998-11 |
Recommendation of (IP)TV programs based on Collaborative Filtering using n-tuple item Clustering Kim, E; Pyo, S; Kim, MunChurl, UXTV 2008, 2008-11 |
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