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Showing results 1 to 12 of 12

1
320 Gb/s (32 x 10 Gb/s) WDM transmission with 50 GHz channel spacing over 430 km of densely dispersion-managed fiber

Chung, Yun Chur; Chung, HS; Kim, H; Jin, SE; Son, ES; Kim, DW; Lee, KM, Optoelectronics and Communications Conference, 2000

2
640 Gb/s WDM transmission with 0.4 (bit/s)/Hz spectral efficiency using short-period dispersion-managed fiber (Perfect Cable)

Chung, Yun Chur; Chung, HS; Jin, SE; Lee, DW; Kim, DW, Optical Fiber Communication Conference, v.54, no.4, 2001-03-17

3
A comparative analysis of short- and long-wavelength multi-chip optical transmitter modules for optical pcb applications

Shirazy, SM; Ukaegbu, AI; Kim, DW; Lee, TW; Cho, MH; Kim, SJ; Yoo, BS; et al, Photonics Packaging, Integration, and Interconnects IX, v.7221, pp.0 - 0, SPIE, 2009-01-26

4
A Novel Area-Variable Varactor Diode

Hong, Songcheol; Kim, DW; Son, JH; Kwon, YS, International Symposium on Circuits and Systems, 1994

5
Comparison of long- and short-wavelength optical transmitters for optical PCB applications

Kim, DW; Shorab Muslima, SM; Ukaegbu, AI; Lee, TW; Cho, MH; Kim, SJ; Yoo, BS; et al, Photonics Packaging, Integration, and Interconnects IX, v.7221, no.0, pp.0 - 0, SPIE, 2009-01-26

6
Effects of Buffer Structures of InGaAs MESFETs.

Kwon, Young Se; Hong, Songcheol; Lee, JJ; Kim, DW; Lee, HG; Pyun, KE; Kwon, YS, International Symposium on Compound Semiconductors, 1995

7
Invited paper: Application of fiber-optic technology for PCB-based optical interconnection systems

Park, HyoHoon; Lee, TW; Kim, DW; Hwang, SH; Kang, SaeK, 6th International Conference on Optics-Photonics Design and Fabrication (ODF) 2008, pp.0 - 0, ODF, 2008-06-10

8
Invited paper: Driver-receiver combined optical transceivers modules for bidirectional optical interconnection

Park, HyoHoon; Kang, SK; Kim, DW; Lee, TW, SPIE Photonics West 2008, pp.0 - 0, SPIE, 2008-01-19

9
Optical link between FPGA microprocessors using a fiber embedded rigid PCB

Kim, DW; Lee, TW; Im, DM; Cho, MH; Lee, MH; Choi, JB; Park, HyoHoon, Optoelectronic Interconnects and Component Integration IX, Optoelectronic Interconnects and Component Integration IX, 2010-01-25

10
Passive packaging solutions using the fiber-optic technology for optical-PCB-based interconnection systems

Park, HyoHoon; Lee, TW; Hwang, SH; Kim, DW, Electronics Circuits World Convention (ECWC) 11, pp.0 - 0, ECWC, 2008-03-15

11
Thermally stable and low-loss optical waveguide using optical-fiber- embedded epoxy matrix for optical printed-circuit board applications

Im, DM; Kim, JH; Cho, MH; Kim, DW; Kim, SJ; Choi, JB; Park, HyoHoon, Optoelectronic Interconnects and Component Integration IX, Optoelectronic Interconnects and Component Integration IX, 2010-01-25

12
Thermally stable polymeric waveguide using UV-curable epoxy resins for optical printedcircuit board

Kim, DW; Ahn, SH; Cho, IK; Im, DM; Shorab Muslim, SM; Park, HyoHoon, 11th International Conference on Advanced Communication Technology, ICACT 2009, v.2, pp.1430 - 1432, ICACT, 2009-02-15

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