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Through Silicon Via (TSV) Noise Coupling Effects on RF LC-VCO in 3D IC

Kim, Joung-Ho; Lim,Jaemin; Cho,Jonghyun; Lee,Manho; Jung,Danial H; Choi,sumin; Lee,Hyunsuk, 23rd Conference on Electrical Performance of Electronic Packaging and Systems, 23rd Conference on Electrical Performance of Electronic Packaging and Systems, 2014-10-26

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