Browse "EE-Conference Papers(학술회의논문)" by Author Jonghoon J
Showing results 1 to 2 of 2
| Fault Detection and Isolation of Multiple Defects in Through Silicon Via (TSV) Channel Kim, Joungho; Heegon Kim; Jonghoon J; Sukjin Kim; Hyun-Cheol Bae; Kwang-Seong Cho, IEEE International 3D Systems Integration Conference, IEEE International 3D Systems Integration Conference, 2014-12-01 |
| Measurement-based Signal Quality Test of High-speed TSV Channel Kim, Joungho; Heegon Kim; Jonghyun Cho; Daniel H. Jung; Jonghoon J; Jun So Pak, 2012 International Microelectronics and Packaging Society, IEEE, 2010-09-14 |
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