DSpace at KOASAS
Browsing DSpace

Browse "EE-Conference Papers(학술회의논문)" by Author Jeong, Seung Taek

A to Z

All 0-9

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:

Showing results 1 to 10 of 10

1
A deep neural network-based estimation of efficiency enhancement by an intermediate coil in automotive wireless power transfer system

Sim, Boogyo; Lho, Daehwan; Park, Dongryul; Lee, Seongsoo; Jeong, Seung Taek; Kim, Hongseok; Park, Hyunwook; et al, 2020 IEEE Wireless Power Transfer Conference, WPTC 2020, pp.231 - 233, Institute of Electrical and Electronics Engineers Inc., 2020-11

2
A Dual Resonance near Field Communication Coil for EMF Reduction in near Field Communication and Wireless Power Transfer Dual Coil System

Hong, Seokwoo; Jeong, Seung Taek; Lee, Seong Soo; Sim, BooGyo; Kim, Hongseok; Kim, Joungho, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019, pp.644 - 647, Institute of Electrical and Electronics Engineers Inc., 2019-07

3
A New Design Method of GDDR6 WCLK Using Reinforcement Learning for over 20Gbps

Park, Hyunwook; Kim, Joungho; Cho, Kyungjun; Sim, BooGyo; Kim, Subin; Jeong, Seung Taek, DesignCon 2021, IEEE, 2021-08-16

4
Design and Analysis of Double-Eight Shaped Shielding Coil for Solenoid Coil in Loosely-Coupled Wireless Power Transfer System

Sim, BooGyo; Jeong, Seung Taek; Lee, Seongsoo; Hong, Seokwoo; Kim, Hongseok; Kim, Joungho, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019, pp.639 - 643, Institute of Electrical and Electronics Engineers Inc., 2019-07

5
Design and analysis of flexible interconnects on an extremely thin silicon substate for flexible wearable devices

Jeong, Seung Taek; Kim, Subin; Kim, Youngwoo; Park, Shinyoung; Park, Hyunwook; Kim, Joungho; Lee, Jae Hak; et al, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.387 - 390, Institute of Electrical and Electronics Engineers Inc., 2019-06

6
Design and Analysis of Thermal Transmission Line based Embedded Cooling Structures for High Bandwidth Memory Module and 2.5D/3D ICs

Son, Keeyoung; Kim, Subin; Park, Shinyoung; Park, Hyunwook; Kim, Keunwoo; Shin, Taein; Kim, Minsu; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12

7
High Efficiency Wireless Power Transfer System using a Two-stack Hybrid Metamaterial Slab

Lee, Seongsoo; Cho, Yeonje; Jeong, Seung Taek; Hong, Seokwoo; Sim, Boogyo; Kim, Hongseok; Kim, Joungho, 2019 IEEE Wireless Power Transfer Conference, WPTC 2019, pp.616 - 619, Institute of Electrical and Electronics Engineers Inc., 2019-06

8
Highly-Effective Integrated EMI Shields with Graphene and Nanomagnetic Multilayered Composites

Watanabe, Atom O; Jeong, Seung Taek; Kim, Subin; Kim, Youngwoo; Min, Junki; Wong, Denny; Pulugurtha, Markondeya R.; et al, 66th IEEE Electronic Components and Technology Conference, ECTC 2016, pp.206 - 210, Institute of Electrical and Electronics Engineers Inc., 2016-05

9
Intra-pair Skew Impact Analysis of High-speed Cables for HDMI Interface

Sim, BooGyo; Kim, Joungho; Kim, Keunwoo; Shin, TaeIn; Park, Hyunwook; Kim, SeongGuk; Lho, Daehwan; et al, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-10

10
Wireless Memory Test: A Breakthrough Solution for Highly Reliable HBM

Park, Hyunwook; Kim, Joungho; Kim, Subin; Kim, SeongGuk; Jeong, Seung Taek; Park, Gap Yeol, Designcon 2021, IEEE, 2021-08-17

Discover

rss_1.0 rss_2.0 atom_1.0