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Improvement of adhesion and microwave transmission characteristics of indium bump by silver coating for low temperature flip-chip applications

Chu, KM; Choi, JH; Lee, JS; Cho, HS; Park, SeongOok; Park, HyoHoon; Jeon, DukYoung, Materials, Intergration and Packaging Issues for High-Frequency Devices II, pp.75 - 80, Materials Research Society Symposium, 2004-11-29

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