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Crosstalk-Included Eye-Diagram Estimation for High-speed Silicon, Organic, and Glass Interposer Channels on 2.5D/3D IC Kim, Joungho; Heegon Kim; Daniel H. Jung; Jonghoon J. Kim; Jaemin Lim; Hyunsuk Lee; Kyungjun Cho; et al, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31 |
Noise coupling emulation between TSV and active circuit through metal oxide patch Kim, Joungho; Jonghyun Cho; Jaemin Lim, 65th Electronic Components and Technology Conference (ECTC), 65th Electronic Components and Technology Conference (ECTC), 2015-05-28 |
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