Browse "EE-Conference Papers(학술회의논문)" by Author Han J.-H.

Showing results 1 to 1 of 1

1
Low cost wafer-level packaging method based on anodized aluminum substrate with backside signal pad and EMC passivation

Kim Y.-J.; Han J.-H.; Kim J.-W.; Kwon, Young Se, 60th Electronic Components and Technology Conference, ECTC 2010, pp.1664 - 1668, 2010-06-01

rss_1.0 rss_2.0 atom_1.0