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Coaxial through-package-vias (TPVs) for enhancing power integrity in 3D double-side glass interposers

Kumar, Gokul; Raj, P. Markondeya; Cho, Jounghyun; Gandhi, Saumya; Chakraborti, Parthasarathi; Sundaram, Venky; Kim, Joungho; et al, 64th Electronic Components and Technology Conference, ECTC 2014, pp.541 - 547, Institute of Electrical and Electronics Engineers Inc., 2014-05

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