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Showing results 1 to 5 of 5

1
Fabrication of an optical interconnection plate using a polymeric waveguide and a transparent substrate

Cho, HS; Eo, JY; Kang, S; Han, MG; Chu, KM; Rho, BS; Park, HyoHoon, The Fifth Pacific Rim Conference on Laser and Electro-Optics, pp.0 - 0, 2003-12-15

2
Improvement of Adhesion and Microwave Transmission Characteristics of Indium Bump by Silver Coating for Low Temperature Flip-Chip Application

Jeon, Duk Young; Chu, KM; Lee, JS; Park, HyoHoon, 2005 GIST/KAIST/Kyoto/Tohoku university joint symposium, pp.13 -, 2005

3
Improvement of adhesion and microwave transmission characteristics of indium bump by silver coating for low temperature flip-chip applications

Chu, KM; Choi, JH; Lee, JS; Cho, HS; Park, SeongOok; Park, HyoHoon; Jeon, DukYoung, Materials, Intergration and Packaging Issues for High-Frequency Devices II, pp.75 - 80, Materials Research Society Symposium, 2004-11-29

4
Integration of optical devices on a transparent substrate for chip levels optical interconnection.

Cho, HS; Eo, JY; Kang,S; Chu, KM; Rho, BS; Park, HyoHoon; Kim, JS; et al, COIN/ACOFT, pp.0 - 0, 2003-07-13

5
Optimization of low temperature flip-chip bonding for VCSEL arrays for polymeric-waveguide-integrated optical interconnection systems

Jeon, Duk Young; Chu, KM; Lee, JS; Rho, BS; Cho, HS; Park, Hyo Hoon, Microoptics Conference, pp.402 - 405, 2003

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