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Showing results 1 to 5 of 5

1
A Fast Channel Simulation Method including Internal PDN Noise of Pseudo-differential Receiver Buffer

Kim, Hee Gon; Choi, Su Min; Kim, Jong Hoon; Jung, Daniel Hyunsuk; Lee, Hyun Suk; Cho, Kyung Jun; Kim, Joung Ho, 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 2015-11-23

2
Design and Signal Integrity Analysis of High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module

Lee, Hyun Suk; Cho, Kyung Jun; Kim, Hee Gon; Choi, Su Min; Lim, Jae Min; Shim, Hyun Woo; Kim, Joung Ho, 24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015-10-25

3
Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC

Lim, Jae Min; Lee, Man Ho; Jung, Daniel HY; Kim, Jong Hoon; Choi, Su Min; Lee, Hyun Suk; Kim, Joung Ho, 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015-11-11

4
Signal Integrity of High Bandwidth Memory (HBM) Interposer

Cho, Kyung Jun; Lee, Hyun Suk; Kim, Hee Gon; Choi, Su Min; Lim, Jae Min; Kim, Hyung Soo; Kim, Young Ju; et al, 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 2015-11-23

5
TSV-based Current Probing Structure using Magnetic Coupling in 2.5D and 3D IC

Kim, Jong Hoon; Jung, Daniel Hyunsuk; Kim, Hee Gon; Kong, Sun Kyu; Choi, Su Min; Lim, Jae Min; Kim, Joung Ho, 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015-11-11

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