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Thermal Analysis of DDR5 DIMM with Forced Air Cooling Method Son, Keeyoung; Kim, Joungho; Lho, Daehwan; Kim, SeongGuk; Park, Joonsang; Kim, Keunwoo; Choi, Namhyeon; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, IEEE, 2022-12-13 |
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