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Showing results 1 to 3 of 3

1
Electrical Design of silicon, glass and organic interposer channels

Kim, Joung-Ho; Kim, Heegon; Cho,Jonghyun; Kim,Youngwoo, 2014 Pan Pacific Microelectronics Symposium, 2014 Pan Pacific Microelectronics Symposium, 2014-02-11

2
Temperature-Dependent Through-Silicon Via (TSV) Model and Noise Coupling

Lee, Manho; Cho,Jonghyun; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; et al, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24

3
Through Silicon Via (TSV) Noise Coupling Effects on RF LC-VCO in 3D IC

Kim, Joung-Ho; Lim,Jaemin; Cho,Jonghyun; Lee,Manho; Jung,Danial H; Choi,sumin; Lee,Hyunsuk, 23rd Conference on Electrical Performance of Electronic Packaging and Systems, 23rd Conference on Electrical Performance of Electronic Packaging and Systems, 2014-10-26

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