Browse "EE-Conference Papers(학술회의논문)" by Author Cho, Jonghyun
Showing results 1 to 26 of 26
| A Compact On-interposer Passive Equalizer for Chip-to-chip High-speed Data Transmission Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Kiyeong; Choi, Sumin; Kim, Joungho; Pak, Jun So, 21th Conference on Electrical Performance of Electronic Packaging and Systems, IEEE, 2012-10-23 |
| Analysis of Power Distribution Network in Glass, Silicon Interposer and PCB Kim, Joung-Ho; Kim, Youngwoo; Kim, Kiyeong; Cho, Jonghyun; Sundaram, Venky; Tummala, Rao, 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SI/PI), 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SI/PI), 2014-08-03 |
| Basic Analysis of Signal and Power Integrity of TSV Applications Pak, Jun So; Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Kiyeong; Kim, Joungho, 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012-05-18 |
| Channel Design for Wide System Bandwidth in a TSV based 3D IC Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Myunghoi; Lee, Junho; Lee, Hyungdng; Park, Kunwo; et al, 2011 Signal Propagation on Interconnects, 2011 Signal Propagation on Interconnects, 2010-12 |
| Design and Implementation of Magnetically Coupled Current Probe for Monitoring Simultaneous Switching current in Package Kim, Joungho; Cho, Changhyun; Cho, Jonghyun; Kim, Jonghoon J; Pak, Jun so, 14th Electronics Packaging Technology Conference (EPTC), EPTC2012, 2012-12-05 |
| Design and Implementation of On-chip Embedded Current Probe Using Magnetic Field Coupling in Chip to Chip Wireless Power Transfer System Cho, Changhyun; Cho, Jonghyun; Kim, Myunghoi; Kim, Joungho; Pak, Jun So, 2012 IEEE MTT-S International Microwave Workshop Series (IMWS) on Innovative Wireless Power Transmission, 2012 IEEE MTT-S International Microwave Workshop Series (IMWS) on Innovative Wireless Power Transmission, 2012-05-11 |
| Design and Measurement of a Compact On-interposer Passive Equalizer for Chip-to-chip High-speed Differential Signaling Kim, Joungho; Kim, Heegon; Cho, Jonghyun; Jung, Daniel H; Kim, Jonghoon J; Choi, Sumin; Lee, Junho; et al, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.5 - 9, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 |
| Design of a Mobile AP GPU PDN based on Chip Power Model and Measurement Kim, Youngwoo; Kim, Joungho; Kim, Heegon; Cho, Jonghyun; Kang, Kibum; Yang, Taisik; Paik, Woohyun, DesignCon 2016, DesignCon 2016, 2016-01-19 |
| Distributed Multi TSV 3D Clock Distribution Network in TSV-based 3D IC Kim, Kayoung; Kim, Joohee; Cho, Jonghyun; Pak, Jun So; Kim Joungho; Lee, Hyungdong; Lee, Junho; et al, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 |
| Electrical Performance of 3D TSV Channel and 3D Stacked PDN based on Hierarchical Models Pak, Jun So; Kim, Joohee; Cho, Jonghyun; Kim, Heegon; Kim, Joungho, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011-03-01 |
| Electromagnetic Bandgap Design for Power Distribution Network Noise Isolation in the Glass Interposer Kim, Joungho; Kim, Youngwoo; Song, Jinwook; Kim, Subin; Venky, Sundaram; Ao, Tummala; Cho, Jonghyun, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31 |
| High-frequency Measurements of TSV failures Kim, Joohee; Cho, Jonghyun; Pak, Jun So; Kim, Joungho; Yook, Jong-Min; Kim, Jun Chul, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
| High-Freuquency TSV Failure Analysis Kim, Joohee; Cho, Jonghyun; Jung, Hyunsuk; Pak, Jun So; Yook, Jong-Min; Kim, Joungho; Kim, Jun Chul, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 |
| How to Improve Power Integrity on Analog-to-Digital Converter (ADC) with Chip-PCB Hierarchical Structure Kim, Joungho; Bae, Bumhee; Cho, Jonghyun; Kong, Sunkyu; Kim, Jonghoon J; Shim, Yujeing, 2013 Design Con, 2013 Design Con, 2013-01-31 |
| Investigation of LC-VCO Performance Degradation due to TSV-Coupled Noise in 3D IC Kim, Joungho; Lim, Jaemin; Cho, Jonghyun; Lee, Manho; Park, Kunwoo; Lee, Junho, 2013 Asia-Pacific Radio Science Conference (AP-RASC 2013), 2013 Asia-Pacific Radio Science Conference (AP-RASC 2013), 2013-09-03 |
| Mobile AP GPU Power Distribution Network Simulation and Analysis based on Chip Power Model Kim, Youngwoo; Kim, Joungho; Kim, Heegon; Cho, Jonghyun; Kang, Kibum; Yang, Taisik; Paik, Woohyun, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 |
| Modeling and Analysis of Power Supply Noise Effects on Analog-to-Digital Converter in 3DIC Bae, Bumhee; Shim, Yujeong; Cho, Jonghyun; Kim, Joungho, 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2011, 2011-11-06 |
| Noise Coupling Modeling and Analysis of Through Glass Via(TGV) Kim, Joungho; Kim, Jihye; Kim, Youngwoo; Cho, Jonghyun; Venky Sundaram; Rao Tummala, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31 |
| Nonlinear Effects of TSV and Harmonic Generation Cho, Jonghyun; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; Pak, Kunwoo, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
| On-chip Design Technque for Reducing Power Supply Noise Coupling on ADC with Chip-PCB Hierarchical Structure Bae, Bumhee; Cho, Jonghyun; Kim, Joungho, 2012 IEEE Electromagnetic Compatibility Symposium, 2012 IEEE Electromagnetic Compatibility Symposium, 2012-08-15 |
| Si-interposer Design for GPU-Memory Integration concerning the Signal Integrity Kim, Joungho; Kim, Lee-Sup; Cho, Jonghyun; Kim, Joohee; Bae, Hyuncheol; Choi, Kwangseong; Paek, Seungwook, 2013 Design Con, 2013 Design Con, 2013-01-31 |
| Simultaneous switching noise coupling through via transition for a CMOS negative feedback Operational Amplifier in System-in-Package Bae, Bumhee; Shim, Yujeong; Cho, Jonghyun; Kim Joungho, 2011 IEEE 54th International Midwest Symposium on Circuits and Systems, 2011 IEEE 54th International Midwest Symposium on Circuits and Systems, 2011-08-10 |
| Suppression of Leakage Magnetic Field from a Wireless Power Transfer System using Ferrimagnetic Material and Metallic Shielding Kim, Hongseok; Cho, Jonghyun; Ahn, Seungyoung; Kim, Jong Hoon; Kim, Joungho, 2012 IEEE Electromagnetic Compatibility Symposium, 2012 IEEE Electromagnetic Compatibility Symposium, 2012-08-15 |
| Suppression of Power Distribution Network(PDN) Resonances in Glass Interposer Kim, Joungho; Kim, Youngwoo; Cho, Jonghyun, Global Interposer Workshop 2013, Global Interposer Workshop 2013 in Georgia Institute of Technology, 2013-11-17 |
| Thermal Effects on Through-Silicon-Via (TSV) Signal Integrity Lee, Manho; Cho, Jonghyun; Pak, Jun So; Lee, Hyungdong; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
| Through-Silicon Via (TSV) Depletion Effect Cho, Jonghyun; Kim, Myunghoi; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; et al, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 |
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