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TSV-based Current Probing Structure using Magnetic Coupling in 2.5D and 3D IC

Kim, Jong Hoon; Jung, Daniel Hyunsuk; Kim, Hee Gon; Kong, Sun Kyu; Choi, Su Min; Lim, Jae Min; Kim, Joung Ho, 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015-11-11

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