Browse "EE-Conference Papers(학술회의논문)" by Author Bae, Bumhee

Showing results 13 to 22 of 22

13
How to Improve Power Integrity on Analog-to-Digital Converter (ADC) with Chip-PCB Hierarchical Structure

Kim, Joungho; Bae, Bumhee; Cho, Jonghyun; Kong, Sunkyu; Kim, Jonghoon J; Shim, Yujeing, 2013 Design Con, 2013 Design Con, 2013-01-31

14
Magnetic Field Coupling on Analog-to-digital Converter from Wireless Power Transfer System in Automotive Environment

Kim, Joungho; Bae, Bumhee; Kong, Sunkyu; Kim, Jonghoon J; Kim, Sukjin, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.238 - 242, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15

15
Measurement of High-bandwidth and High-density Silicone Rubber Socket up to 110GHz

Park, Junyong; Kim, Joungho; Kim, Hyesoo; Kim, Jonghoon J; Bae, Bumhee; Ha, Dongho; Bae, Michael, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31

16
Modeling and analysis of a conductive rubber contactor for package test

Kim, Hyesoo; Bae, Bumhee; Kim, Jonghoon J; Park, Junyong; Ha, Dongho; Bae, Michael; Kim, Joungho, 17th IEEE Electronics Packaging and Technology Conference, EPTC 2015, Institute of Electrical and Electronics Engineers Inc., 2015-12

17
Modeling and Analysis of Power Supply Noise Effects on Analog-to-Digital Converter in 3DIC

Bae, Bumhee; Shim, Yujeong; Cho, Jonghyun; Kim, Joungho, 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2011, 2011-11-06

18
Modeling of Simultaneous Switching Noise Effects on Jitter Characteristics of Delay Locked Loop in a Hierarchical System of Chip-Package-PCB

Shim, Yujeong; Bae, Bumhee; Koo, Koungchoul; Kim, Joungho, 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2011, 2011-11-07

19
On-chip Design Technque for Reducing Power Supply Noise Coupling on ADC with Chip-PCB Hierarchical Structure

Bae, Bumhee; Cho, Jonghyun; Kim, Joungho, 2012 IEEE Electromagnetic Compatibility Symposium, 2012 IEEE Electromagnetic Compatibility Symposium, 2012-08-15

20
Shielding effectiveness of noise coupling on Analog-to-digital converter in magnetic field wireless power transfer system

Bae, Bumhee; Kim, Sukjin; Kwon, YoungKun; Kim, HyungGeun; Park, HarkByeong; Kong, Sunkyu; Kim, Joungho, 11th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMCCompo 2017, pp.50 - 53, Institute of Electrical and Electronics Engineers Inc., 2017-07

21
Simultaneous switching noise coupling through via transition for a CMOS negative feedback Operational Amplifier in System-in-Package

Bae, Bumhee; Shim, Yujeong; Cho, Jonghyun; Kim Joungho, 2011 IEEE 54th International Midwest Symposium on Circuits and Systems, 2011 IEEE 54th International Midwest Symposium on Circuits and Systems, 2011-08-10

22
Vertically Alternating Impedance Electromagnetic Bandgap (VAI-EBG) Structure for Noise Mitigation in Multi-layer PCBs

Kim, myunghoi; Koo, Kyoungchoul; Kong, Sunkyu; Bae, Bumhee; Lee, Sangrok; Kim Joungho, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011-05-17

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