Browse "EE-Conference Papers(학술회의논문)" by Author Iyer, Mahadevan K

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Investigation of Plane-to-Plane Noise Coupling through Cutout in Multi-layer Power/Ground Planes

Kim, Joungho; Lee, Junwoo; Seng, Yeo Mui; Iyer, Mahadevan K, IEEE 4th Electronics Packaging Technology Conference, pp.257 - 260, IEEE, 2002-12

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