Showing results 7981 to 8000 of 22915
Electrical evaluation of laser annealed junctions by Hall measurement Cho, Byung Jin; Poon, DCH; Tan, LS; Bhat, M; Chan, L, 2nd International Conference on Materials for Advanced Technologies, pp.578 - 578, 2003-12-11 |
Electrical instablility of induction motor driven by CSI with output capacitors Youn, Myung Joong; Song, JH; Kim, KB, pp.538 - 543, 1993-04 |
Electrical Performance Analysis of Glass Interposer Channel and Power Distribution Network Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Jeong, Seungtaek; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.3 - 5, IEEE, 2018-10-15 |
Electrical Performance Analysis of Low-Cost and Ultra-Thin Glass Interposer: Advantages, Challenges and Solutions Kim, Joungho; Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Park, Shinyoung; Ahn, Seungyoung, DesignCon 2018, DesignCon 2018, 2018-01-31 |
Electrical performance comparison between coaxial and non-coaxial silicone rubber socket Park, Junyong; Ha, Dongho; Shin, Taein; Kim, Seongguk; Park, Hyunwook; Lho, Daehwan; Cho, Kyungjun; et al, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.293 - 296, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
Electrical Performance of 3D TSV Channel and 3D Stacked PDN based on Hierarchical Models Pak, Jun So; Kim, Joohee; Cho, Jonghyun; Kim, Heegon; Kim, Joungho, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011-03-01 |
Electrical Performance of High Bandwidth Memory (HBM) Interposer Channel in Terabyte/s Bandwidth Graphics Module Kim, Joungho; Cho, Kyungjun; Kim, Heegon; Choi, Sumin; Lim, Jaemin, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31 |
Electrical Properties of CMOS Devices with Cu Local Interconnects Cho, Byung Jin; Xie, H; Yoo, WJ; Zhu, C; Lim, SY; Tan, D; Lai, D, 8th International Conference on Dielectrics & Conductors for ULSI Multilevel Interconnection (DCMIC), pp.0 - 0, 2002-02-25 |
Electrical Properties of Ferroelectirc VDF/TrFE Copolymer Thin Film Using Au Electrode 이희철, 제14회 반도체학술대회, 2007-02-01 |
Electrical Transport Properties of Chain-Shaped Tunnel-Junction Arrays Shin, Mincheol; Lee, S; Park, KW; Lee, EH, SQS (International Workshop on Physics and Applications of Semiconductor Quantum Structures), pp.0 - 0, SQS, 1998-10-01 |
Electrical tuning of complex reflectivity with graphene-based metasurface Han, Sangjun; Ha, Heonhak; Jang, Min Seok, The 9th International Conference on Surface Plasmon Photonics, BDP Congress, 2019-05-30 |
Electrically Band-Limited Return-to-Zero Signal with Simple Generation Using A Single-Electrode Mach-Zehnder Modulator Lee, Man Seop, OECC/COIN 2004, 2004-07 |
Electrically driven surface plasmon polaritons circuits Kwon, Kyungmook; Choi, Kyunghan; You, Jong Bum; Shin, Juhyeon; Yu, Kyoungsik, Microoptics conference, Japan Society of Applied Physics, 2015-10-26 |
Electrically Tunable Metasurface for Complex Amplitude Modulation Han, Sangjun; Kim, Seyoon; Kim, Sinho; Tony, Low; Victor, Brar; Jang, Min Seok, META 2021 The 11th International Conference on Metamaterials, Photonic Crystals and Plasmonics, International Conference on Metamaterials, 2021-07-20 |
Electrically Tunable Metasurface for Complex Amplitude Modulation Jang, Min Seok, Smart Nanomaterials 2020, NT-MDT Spectrum Instruments, 2020-12-10 |
Electrically tunable metasurface for complex amplitude modulation Han, Sang Jun; Kim, Se Yoon; Jang, Min Seok; Kim, Shin Ho; Tony, Low; Victor, Brar, Nanophotonics of 2D materials, N2D, 2020-07-15 |
Electro-Optic Implementation of Matrix Inversion Based on the Neural Networks Model Park, JS.; Jang, JS.; Lee, Soo-Young; Shin, SY., Proceedings of the 3rd Conference on Waves and Lasers '88, pp.135 - 137, 1988-02 |
Electro-Optical Sensor Selection based on Flight Test for Detect-and-Avoid in Phase Two UAS Lee, Jaehyun; Shim, David Hyunchul; Kim, Seungjoo, 38th IEEE/AIAA Digital Avionics Systems Conference, DASC 2019, Institute of Electrical and Electronics Engineers Inc., 2019-09-12 |
Electroceuticals for wound healing and brain disease treatment by using freeform OLEDs Park, Yongjin; Noh, Byeongju; Choi, Kyung Cheol, IMID 2022 (International Meeting on Information Display), International Meeting on Information Display, 2022-08 |
Electrochemical CdTe deposition for HgCdTe surface passivation Choi, J.-H.; Lee, Hee Chul, Materials for Infrared Detectors II, v.4795, pp.113 - 120, 2002-07-08 |
Discover