Reliability evaluation for flip-chip electronic packages using optical measurement techniques광 측정 기법을 이용한 플립 칩 전자패키지의 신뢰성 평가
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | Lee, Soon-Bok | - |
| dc.contributor.advisor | 이순복 | - |
| dc.contributor.author | Yang, Se-Young | - |
| dc.contributor.author | 양세영 | - |
| dc.date.accessioned | 2011-12-14T05:26:37Z | - |
| dc.date.available | 2011-12-14T05:26:37Z | - |
| dc.date.issued | 2005 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=244784&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/43551 | - |
| dc.description | 학위논문(박사) - 한국과학기술원 : 기계공학전공, 2005.2, [ xiv, 186 p. ] | - |
| dc.language | eng | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | Flip-Chip | - |
| dc.subject | Reliability | - |
| dc.subject | Optical Measurement Technique | - |
| dc.subject | 광 측정 기법 | - |
| dc.subject | 플립 칩 | - |
| dc.subject | 신뢰성 | - |
| dc.title | Reliability evaluation for flip-chip electronic packages using optical measurement techniques | - |
| dc.title.alternative | 광 측정 기법을 이용한 플립 칩 전자패키지의 신뢰성 평가 | - |
| dc.type | Thesis(Ph.D) | - |
| dc.identifier.CNRN | 244784/325007 | - |
| dc.description.department | 한국과학기술원 : 기계공학전공, | - |
| dc.identifier.uid | 020005180 | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
| dc.contributor.localauthor | 이순복 | - |
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- ME-Theses_Ph.D.(박사논문)
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