학위논문(박사) - 한국과학기술원 : 기계공학전공, 2009.2, [ viii, 66 p. ]
vacuum insulation chip; multi-layer; thermal conductivity; 진공단열칩; 다층구조; 열전도도; vacuum insulation chip; multi-layer; thermal conductivity; 진공단열칩; 다층구조; 열전도도
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